Samsung Sdi Co., Inc.

Cheil Industries Inc.

Sung Min Ko

Seong Ryong Nam

Ji Yeon Lee

Mi Sun Kim

Hye Jin Kim

Mi Jeong Choi

Kyoung Jin Ha

Seung Jib Choi

Chang Min Lee

Se Il Oh

Han Sung Yu

Chang Soo Woo

Ji Hye Kwon

Yeon Soo Lee

Bum Jin Lee

Provided are a composition for encapsulating an organic light emitting element and an organic light emitting element display device manufactured therefrom, the composition comprising: (A) a non-silicone-based photocurable multifunctional monomer; (B) a silicone-based photocurable multifunctional monomer; (C) a non-silicone-based photocurable monofunctional monomer; (D) a silicone-based photocurable monofunctional monomer; and (E) an initiator, wherein the silicone-based photocurable multifunctional monomer (B) is represented by chemical formula 1.

Composition for encapsulating organic light emitting element and organic light emitting element display device manufactured therefrom

Provided are: a composition for an organic light emitting diode comprising an indole-based photocurable monomer, a non-indole-based photocurable monomer, and an initiator, and an organic light emitting display manufactured therefrom.

Composition for organic light emitting diode encapsulation and organic light emitting diode display manufactured therefrom

Disclosed is an organic light emitting display device including a substrate, an organic light emitting element formed on the substrate, and an encapsulation layer encapsulating the organic light emitting element, wherein the encapsulation layer has a structure in which at least two inorganic layers and at least one organic layer are alternately stacked one above another, each of the inorganic layers having a thickness of about 40 nm to about 1,000 nm and an index of refraction of about 1.41 to about 2.0, each of the organic layer having a thickness of about 0.2 &#x3bc;m to about 15 &#x3bc;m and an index of refraction of about 1.4 to about 1.65, the organic layer including a composition for encapsulating a display device, the composition for encapsulating a display device including a photocurable monomer and a photopolymerization initiator.

Organic light emitting display

Provided is an organic light emitting display comprising: a substrate including a light emitting zone and a non-light emitting zone, which is positioned around the outside of the light emitting zone; at least one organic light emitting diode formed on the light emitting zone; an encapsulation layer for sealing the organic light emitting diode; and a dam formed on the non-light emitting zone, wherein the encapsulation layer includes a structure in which at least one inorganic layer and at least one organic layer are alternatingly stacked, wherein the organic layer is made from a display sealing material composition, and wherein the display sealing material composition comprises a photo-curable monomer and a photopolymerization initiator. The photo-curable monomer comprises: a monomer not having an aromatic hydrocarbon group; and a monomer, represented by chemical formula 1, having at least two substituted or non-substituted phenyl groups, wherein the photo-curable monomer comprises approximately 5 wt. % to 45 wt. % of the monomer having the at least two substituted or non-substituted phenyl groups, and approximately 55 wt. % to 95 wt. % of a monomer not having the aromatic hydrocarbon group.

Disclosed is an organic light emitting diode display apparatus including: a substrate; an organic light emitting diode disposed on the substrate; and an encapsulation layer encapsulating the organic light emitting diode. The encapsulation layer has a structure in which two or more inorganic layers and one or more organic layers are alternately stacked one above another, two adjacent inorganic layers at least partially contact each other, and the organic layers are formed of an encapsulating composition. The encapsulating composition includes a photocurable monomer and a photopolymerization initiator. The photocurable monomer includes a monomer containing no aromatic hydrocarbon group; and a monomer having two or more substituted or unsubstituted phenyl groups represented by Formula 1. The photocurable monomer includes about 5 wt % to about 45 wt % of the monomer having two or more substituted or unsubstituted phenyl groups and about 55 wt % to about 95 wt % of the monomer containing no aromatic hydrocarbon group.

The present invention relates to a composition for a display sealing material having a photopolymerization initiator and a photocurable monomer, the photocurable monomer comprising: a monomer not having the aromatic hydrocarbon group; and a monomer having two or more substituted or unsubstituted phenyl groups of chemical formula 1, wherein about 5 wt % to about 45 wt % of the monomer having two or more substituted or unsubstituted phenyl groups is comprised on the basis of the photocurable monomer and about 55 wt % to about 95 wt % of the monomer not having the aromatic hydrocarbon group is comprised on the basis of the photocurable monomer.

Composition for display sealing material, organic protection layer comprising same, and display device comprising same

A display sealing material composition includes a photopolymerization initiator and a photocuring monomer, the photocuring monomer comprising: a monomer not having the aromatic hydrocarbon group; and a monomer having two or more substituted or unsubstituted phenyl groups. An organic protection layer obtained by curing the composition for a display sealing material has approximately 400 nm/min or less plasma etching rate being represented by formula 1 below and approximately 2 nm or less surface roughness.Plasma etching rate(nm/min)=(0&#x2212;1)/&#x2003;&#x2003;&#x3c;Formula 1&#x3e;wherein T0, T1, and M are set forth in the specification.

A composition for encapsulation of an organic light emitting diode and an organic light emitting diode display manufactured using the same. The composition for encapsulation includes: about 10 wt % to about 70 wt % of (A) a non-silicon-based di(meth)acrylate; about 20 wt % to about 70 wt % of (B) a silicon-based di(meth)acrylate; about 5 wt % to about 40 wt % of (C) a mono(meth)acrylate; and about 1 wt % to about 10 wt % of (D) an initiator, wherein the (B) silicon-based di(meth)acrylate is represented by Formula 1.

Organic light emitting device encapsulating composition, and organic light emitting device display apparatus manufactured using same

The present invention relates to a photocurable composition including (A) a photocurable monomer, (B) a monomer of chemical formula 1 or an oligomer thereof and (C) an initiator, a barrier layer including the same and an enveloped device including the same.

Photocurable composition and enveloped device including same

A composition for encapsulating an organic light emitting diode device and an organic light emitting diode display, the composition including a di(meth)acrylate including an unsubstituted alkylene group, a tri(meth)acrylate including a substituted or unsubstituted alkylene group or a substituted or unsubstituted alkyl group, and a photo-initiator, wherein the composition for encapsulating the organic light emitting diode device has a chloride content of about 200 ppm or less.

Composition for encapsulating organic light emitting diode device and organic light emitting diode display using the same

A composition for encapsulation of an organic light emitting diode comprising a photocurable monomer, a silicon-containing monomer, and an initiator, wherein the silicon-containing monomer is represented by Formula 1, and an organic light emitting diode display are disclosed.

Composition for encapsulation of organic light emitting diode and organic light emitting diode display manufactured using the same

Disclosed is an organic light emitting diode display apparatus including: a substrate; an organic light emitting diode disposed on the substrate; and an encapsulation layer encapsulating the organic light emitting diode. The encapsulation layer has a structure in which two or more inorganic layers and one or more organic layers are alternately stacked one above another, two adjacent inorganic layers at least partially contact each other, and the organic layers are formed of an encapsulating composition. The encapsulating composition includes: about 10 wt % to about 70 wt % of (A) a non-silicon-based di(meth)acrylate, about 20 wt % to about 70 wt % of (B) a silicon-based di(meth)acrylate, about 5 wt % to about 40 wt % of (C) a mono(meth)acrylate, and about 1 wt % to about 10 wt % of (D) an initiator, the (B) silicon-based di(meth)acrylate being represented by Formula 1.

Organic light emitting diode display apparatus

Disclosed is an organic light emitting diode display apparatus including: a substrate; an organic light emitting diode disposed on the substrate; and an encapsulation layer encapsulating the organic light emitting diode. The encapsulation layer has a structure in which two or more inorganic layers and one or more organic layers are alternately stacked one above another, each of the inorganic layers has a thickness of about 40 nm to about 1000 nm and an index of refraction of about 1.41 to about 2.0, each of the organic layers has a thickness of about 0.2 &#x3bc;m to about 15 &#x3bc;m and an index of refraction of about 1.4 to about 1.65, and the organic layers are formed of an encapsulating composition. The encapsulating composition includes: about 10 wt % to about 70 wt % of (A) a non-silicon-based di(meth)acrylate, about 20 wt % to about 70 wt % of (B) a silicon-based di(meth)acrylate, about 5 wt % to about 40 wt % of (C) a mono(meth)acrylate, and about 1 wt % to about 10 wt % of (D) an initiator, the (B) silicon-based di(meth)acrylate being represented by Formula 1.

A photocurable composition, a composition for encapsulation of an organic light emitting diode, and an encapsulated apparatus, wherein, in the photocurable composition, when A represents a glass-metal alloy die shear strength in kgf between a glass substrate and a Ni/Fe alloy after curing, and B represents curing shrinkage in % as determined by Equation 1, below, and the photocurable composition has a value for A/B of about 0.7 kgf/% or more and the glass-metal alloy die shear strength of about 2.5 kgf or more,Curing shrinkage=|(Specific gravity of solid photocurable composition after curing)&#x2212;(Specific gravity of liquid photocurable composition before curing)|/(Specific gravity of liquid photocurable composition before curing)&#xd7;100.&#x2003;&#x2003;&#x3c;Equation 1&#x3e;

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Uiwang-si, South Korea

Sung Min Ko