Samsung Electronics Co., Ltd.

Sung Min Jang

Seung Woo Lee

Sun Ki Kim

Ki Won Choi

Kyung Pil Nam

In Hyung Lee

Young Jeong Yoon

Yeon Woo Lee

Byeong Hui Kim

Byeong Woo Yi

Soon Won Jeong

Dong Hyub Kang

Hyun Kyo Oh

Ki Been Jung

A storage system may be connected to a machine learning model embedded device that includes a trained simulation model. The simulation model may be trained based on a loss function, where the loss function is based on a comparison of predicted QoS data and real QOS data. The simulation model may be trained to search for a workload for increasing the QoS using a fixed parameter or, conversely, to search for a parameter for maximizing the QoS using a fixed workload. Further, the machine learning model embedded device may include a map table storing the optimized parameters calculated by the trained simulation model so as to maximize QoS relative to each workload.

Storage system with improved quality of service

A semiconductor light emitting device package includes a lead frame structure including a first lead frame and a second lead frame. A resin portion is adjacent to side surfaces of the first lead frame and the second lead frame. A semiconductor light-emitting device is mounted on the first lead frame and the second lead frame, in the form of a flip chip, by eutectic bonding. Each of the first lead frame and the second lead frame has a plurality of first grooves extended in a first direction.

Semiconductor light emitting device package

There is provided a semiconductor light emitting device including: a heat dissipation structure including one or more of materials among a metal, a ceramic, a semiconductor, and a resin; a flexible insulating layer directly in contact with the heat dissipation structure; a conductive layer laminated on the flexible insulating layer; and a light emitting device mounted on the conductive layer, wherein the light emitting device includes a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer; and first and second electrodes connected to the first and second conductivity-type semiconductor layers, respectively, and the first electrode includes a plurality of conductive vias connected to the first conductivity-type semiconductor layer through the second conductivity-type semiconductor layer and the active layer.

Method of making a substrate structure having a flexible layer

There is provided a light source apparatus including at least one light emitting diode (LED) string including at least one light emitting diode and at least one inductance unit generating an induced current according to a change in a current applied to the light emitting diode, a main switch controlling power applied to the LED string according to an on/off switching operation, and a capacitor charged with a voltage of the power applied to the LED string when the main switch is switched on and applying the charged voltage to the LED string when the main switch is switched off.

Light source apparatus and light emitting diode package

There is provided a light source apparatus including at least one light emitting diode (LED) string including at least one light emitting diode and at least one inductance unit for generating an induced current according to a change in a current applied to the light emitting diode. A main switch controls power applied to the LED string according to an on/off switching operation A capacitor is charged with a voltage of the power applied to the LED string when the main switch is switched on, and applies the charged voltage to the LED string when the main switch is switched off.

An image photographing apparatus capable of maintaining the size of a sensor plate even in a case when the size of a shutter assembly is increased, the image photographing apparatus including a shutter assembly configured to control an amount of light entered, an image sensor disposed at a rear of the shutter assembly to change the light to an electrical signal, a sensor plate configured to support the image sensor, and a main frame configured such that the shutter assembly and the sensor plate are be mounted thereon, wherein the main frame includes a frame base, and a shutter mounting portion protrudedly formed from the frame base such that the shutter assembly is mounted in a sliding manner on the shutter mounting portion.

Growing community of inventors

Gyeonggi-do, South Korea

Sung Min Jang