Samsung Electronics Co., Ltd.

Sung-Kyu Park

Beom-Kyu Shin

Jae-Yong Jeong

Sangsoo Kim

Kui-Yon Mun

Yun-Young Kim

Seung Hwan Kim

Hye-Jin Kim

Sang-Min Lee

Young-Seok Hong

Tae-sung Park

Hyunki Kim

Seung-hwan Kim

Junwoo Park

Beomkyu Shin

Kyung-Man Kim

Pyoungwan Kim

Ji-Hoon Kang

Insup Shin

Jun-Woo Park

Sang-soo Kim

Pilsung Choi

Hee-cheol Kim

Sehun Ahn

Jin-Hwan Oh

Key-jo Hong

Min-Kook Cho

Jeong-Geun Cho

Dae-Yeong Jang

Jerome Crocco

Provided are a memory controller with improved data reliability, a memory system including the memory controller, and a method of operating the memory controller. The memory controller includes an error correction code (ECC) circuit configured to perform an error detection on a codeword read from a memory device; and a processor configured to set at least one memory chip from among a plurality of memory chips as an indicator chip, monitor an error occurrence in the indicator chip based on a result of the error detection, and output reliability deterioration information indicating that the reliability of the memory device is deteriorated based on a result of the monitoring.

Memory controller including ECC circuit, memory system having the same, and method of operating memory system and memory controller

A semiconductor package includes a substrate having a first surface and a second surface opposite to the first surface. A semiconductor chip is on the first surface of the substrate. A passive element is on the second surface of the substrate. The substrate includes a first passive element pad and a second passive element pad that are exposed by the second surface. A dam extends downwardly from the second surface. The dam includes a first dam and a second dam. The passive element is disposed between the first dam and the second dam. The passive element includes a first electrode portion electrically connected to the first passive element pad. A second electrode portion is electrically connected to the second passive element pad.

Semiconductor package

A method of controlling a first memory controller that controls a non-volatile memory device includes: the first memory controller receiving first data and a first physical address from a second memory controller via a first interface of the first memory controller; the first memory controller storing the first data in a non-volatile memory buffer of the first memory controller; and the first memory controller programming the first data stored in the non-volatile memory buffer in a first physical region of the non-volatile memory device corresponding to the first physical address.

Method of operating memory controller and memory system, and the memory system

A memory system includes a memory device, a first controller, and a second controller. The first controller is configured to output a control signal for the memory device and data to be stored in the memory device based on a signal received from a host. The second controller includes a non-volatile memory configured to store the data. The second controller is configured to receive the control signal and the data from the first controller, and control the memory device based on the control signal.

Memory system including a plurality of controllers

A measurement device includes an emitter configured to emit an electromagnetic signal to an object to be measured. A first detector is disposed to measure a first portion of the electromagnetic signal that is reflected by the object to be measured. A second detector is disposed to measure a second portion of the electromagnetic signal that is transmitted through the object to be measured. The emitter is configured to emit the electromagnetic signal in a direction substantially perpendicular to a surface of the object to be measured.

Measurement device and semiconductor manufacturing system including the same

Disclosed are a semiconductor package and a method of fabricating the same. The semiconductor package comprises a lower semiconductor chip on a lower substrate, a lower molding layer covering the lower semiconductor chip on the lower substrate and including a molding cavity that extends toward the lower semiconductor chip from a top surface of the lower molding layer, an interposer substrate on the top surface of the lower molding layer and including a substrate opening that penetrates the interposer substrate and overlaps the molding cavity, and an upper package on the interposer substrate. The molding cavity has a floor surface spaced apart from the upper package across a substantially hollow space.

Semiconductor package having a molding layer including a molding cavity and method of fabricating the same

An apparatus and method operative in a portable terminal, for connecting with a Bluetooth or other short range protocol device are disclosed. The portable terminal searches for the presence of accessories such as a headset or printer within a short range. The terminal pairs with at least one discovered accessory in a pairing process and acquires and stores connection information associated with each paired accessory in the pairing process. The connection information includes at least one of a Bluetooth address, a WiFi address, a security key, and function information for the paired accessory. The connection information is then shared with at least one peer terminal to facilitate subsequent pairing between the at least one peer terminal and the accessory.

Apparatus and method for connecting with bluetooth device in portable terminal

Provided are a semiconductor package and a method for fabricating the same. The semiconductor package includes a lower package comprising a lower substrate, a lower semiconductor chip mounted on the lower substrate and comprising a redistribution, and a molding layer molding the lower semiconductor chip, an upper package comprising an upper substrate and an upper semiconductor chip mounted on the upper substrate, with the upper package being stacked on the lower package. The semiconductor package further includes an electrical interconnector extending from the upper substrate into the molding layer and connected to the redistribution to electrically connect the upper and lower packages to each other, and a dummy interconnector extending from the upper substrate into the molding layer to physically couple the upper and lower packages to each other.

Package-on-package type semiconductor package

Growing community of inventors

Seoul, South Korea

Sung-Kyu Park