Samsung Electro-mechanics Co., Ltd.

Sumitomo Electro-mechanics Co., Ltd.

Sung Kwon Wi

Sang Soo Park

Young Seuck Yoo

Dong Seok Park

Min Cheol Park

Byoung Hwa Lee

Hae Suk Chung

Yong Suk Kim

Sang Moon Lee

Jeong Bok Kwak

Won Chul Sim

Kang Heon Hur

Young Do Kweon

Ju Hwan Yang

Young Ghyu Ahn

Chan Young Yoon

Jin Hyuck Yang

Jong Yun Lee

Geon Se Chang

Hong Yeon Cho

Jeong Min Cho

Jun Hee Bae

Ho Jin Yun

Hyeog Soo Shin

Hye Won Bang

Sung Jin Park

Seok Hyun Yoon

Dong Hun Kim

Jung Wook Seo

Chan Hee Nam

Jung Deok Park

Kyong Bok Min

Kwang Mo Kim

Ill Kyoo Park

Hong Ryul Lee

Eun Ha Kim

There is provided a thin film-type coil component having a size equal to or less than 0806 and including a ceramic main body, external electrodes including a plurality of first external electrodes formed on one surface of the ceramic main body and a plurality of second external electrodes formed on the other surface facing one surface of the ceramic main body, and a coil unit including a plurality of coil layers stacked in the ceramic main body, thereby obtaining low direct current (DC) resistance.

Thin film-type coil component and method of fabricating the same

A dielectric ceramic composition and a multilayer ceramic capacitor containing the same are provided. The dielectric ceramic composition contains a base material powder represented by (1&#x2212;x)BaTiO&#x2212;xPbTiOcontaining a first main ingredient represented by BaTiOand a second main ingredient represented by PbTiO, wherein x satisfies 0.0025&#x2264;x&#x2264;0.4. The multilayer ceramic capacitor includes a ceramic body in which dielectric layers containing the dielectric ceramic composition are alternately stacked with first and second internal electrodes, and first and second external electrodes formed on both end portions of the ceramic body and respectively electrically connected to the first and second internal electrodes.

Dielectric ceramic composition and multilayer ceramic capacitor containing the same

Disclosed herein are a method of manufacturing a common mode filter forming a coil electrode by directly patterning metal layers laminated on both surfaces of a core insulating layer while not using a build-up process, and the common mode filter manufactured according to the method.

Common mode filter and method of manufacturing the same

A common mode filter is manufactured to include a coil part including an insulation layer and a conductor pattern formed in the insulation layer; and a magnetic substrate coupled to one surface or both surfaces of the coil part. The magnetic substrate includes: an electrostatic absorbing layer made of an electrostatic absorbing material; a magnetic layer provided on one surface or both surfaces of the electrostatic absorbing layer and made of a magnetic material; and an electrode provided between the magnetic layer and the electrostatic absorbing layer and made of a conductive material. Therefore, common mode filter may maintain high efficiency characteristics while preventing an electrostatic discharge phenomenon.

Method for manufacturing magnetic substrate and common mode filter

Disclosed herein is a common mode filter, including: a magnetic substrate; and a body part formed on the magnetic substrate, wherein the body part is configured of an insulating layer surrounding a coil electrode, an outer electrode terminal connected with an end of the coil electrode, and a magnetic resin composite, the insulating layer is formed on the magnetic substrate, having a margin part M disposed at an edge of the magnetic substrate, and the magnetic resin composite is filled in an empty space of the body part including the margin part M, thereby promoting a consecutive flow of magnetic flux that is generated from the coil electrode.

A method for manufacturing an inductor including preparing an insulating layer; forming a polymer layer including a coil pattern on the insulating layer; forming a stacked structure by heat treating the insulating layer and the polymer layer; and forming an external electrode to electrically connect the coil pattern for the stacked structure.

Method for manufacturing an inductor

Disclosed herein is a thin film type common mode filter including: a base substrate made of an insulating material; a first insulating layer formed on the base substrate; a coil-shaped internal electrode formed on the first insulating layer; a second insulating layer formed on the internal electrode; an external electrode terminal having a vertical section connected to a side surface of the internal electrode and a horizontal section extended from an upper end of the vertical section toward a horizontal direction to thereby form a parallel surface spaced apart from the internal electrode by a predetermined distance; and a ferrite resin layer formed between the horizontal section of the external electrode terminal and the internal electrode.

Thin film type common mode filter

The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: an insulating layer having a hole; a conductive pattern disposed on both surfaces of the insulating layer and having a structure in which portions disposed on the both surfaces are electrically connected to each other through the hole; and a magnetic layer disposed on the insulating layer to cover the conductive pattern, wherein the conductive pattern has a plating pattern formed by performing a plating process.

Inductor and method for manufacturing the same

Disclosed herein is a common mode filter, including: first and second coil layers electromagnetically coupled to each other; a pair of external terminals connected to ends of the first coil layer and a pair of external terminals connected to ends of the second coil layer; a first ESD prevention member connecting between the pair of external terminals carrying electric current with the first coil layer and a second ESD prevention member connecting between the pair of external terminals carrying electric current with the second coil layer; and a ground electrode connecting the first ESD prevention member to the second ESD prevention member, wherein the ground electrode has a stepped portion formed at the center.

Common mode filter

The present invention relates to a common mode filter and a method of manufacturing the same. In order to implement a common mode filter with low shrinkage, high substrate sintered density, and high strength, the present invention provides a common mode filter including: a lower substrate; an insulating layer having a conductor pattern inside and provided on the lower substrate; an upper substrate provided on the insulating layer; and a ferrite core made of ferrite and provided in the center of the insulating layer, the lower substrate, and the upper substrate by penetrating the insulating layer, the lower substrate, and the upper substrate, and a method of manufacturing the same.

Disclosed herein is an electrostatic discharge protection device including: a lower cover; electrodes disposed on the lower cover, being spaced apart from each other; a conductor disposed on the lower cover; and a semiconducting material layer covering the lower cover and the electrodes and formed of a semiconducting material.

Electrostatic discharge protection device and chip component with the same

Disclosed herein is a filter chip element including a ferrite substrate, internal coil patterns formed on the ferrite substrate; and a ferrite composite layer filled between the internal coil patterns formed on the ferrite substrate, wherein the ferrite composite layer includes foaming resin, thereby increasing magnetic permeability and a Q value which are important characteristics of a filter chip element for noise prevention among electromagnetic shielding components.

Filter chip element and method of preparing the same

Disclosed herein are a common mode filter capable of implementing high inductance without deterioration of a moisture resistance load, and a method of manufacturing the same. The common mode filter includes: a magnetic substrate; an insulating layer disposed on the magnetic substrate; and a coil electrode layer disposed in the insulating layer, wherein the magnetic substrate has a groove part formed at an edge of an upper surface thereof, and a material of the insulating layer is filled into the groove part.

Disclosed herein are a conductor pattern of an electronic component formed in an oval coil shape on a magnetic substrate, the conductor pattern including: a straight part; and a curved part connected to the straight part at both sides thereof, wherein a line width of the curved part is smaller than that of the straight part, and an electronic component including the same. With the conductor pattern and the electronic component including the same according to the present invention, the high precision fine line width and the high resolution conductor pattern may be implemented to improve connectivity, thereby improving characteristics and reliability of the electronic component.

Conductor pattern and electronic component having the same

Disclosed herein is a common mode filter including: a body element including an insulating member enclosing a coil electrode pattern and a magnetic member disposed on one surface or both surfaces of the insulating member; and an insulating layer disposed on at least one side of the body element, thereby increasing an interlayer adhesion between the respective components configuring the common mode filter.

Growing community of inventors

Seoul, South Korea

Sung Kwon Wi