Samsung Electro-mechanics Co., Ltd.

Sk Corporation

Sung Kun Kim

Cheol Seong Hwang

Chang Sup Ryu

Jin Yong Ahn

Ho Sik Jeon

Tae-jin Kim

Suk Hyeon Cho

Suk-Hyeon Cho

Myung-Ahn Ok

Jong-Sok Hahn

Sang-Ook Kang

Mal-Ou Lee

Sung-bo Ko

Tae-Woo Woo

Disclosed is an arylphenoxy catalyst system for producing an ethylene homopolymer or copolymers of ethylene and &#x3b1;-olefins, and a method of producing an ethylene homopolymer or copolymers of ethylene and &#x3b1;-olefins having a high molecular weight under a high temperature solution polymerization condition using the same. The catalyst system includes a group 4 arylphenoxy-based transition metal catalyst and an aluminoxane cocatalyst or a boron compound cocatalyst. In the transition metal catalyst, a cyclopentadienyl derivative and arylphenoxide as fixed ligands are located around the group 4 transition metal, arylphenoxide is substituted with at least one aryl derivative and is located at the ortho position thereof, and the ligands are not crosslinked to each other. The catalyst includes non-toxic raw materials, synthesis of the catalyst is economical, and thermal stability of the catalyst is excellent. It is useful for producing an ethylene homopolymer or copolymers of ethylene and &#x3b1;-olefins having various physical properties in commercial polymerization processes.

Arylphenoxy catalyst system for producing ethylene homopolymer or copolymers of ethylene and &#x3b1;-olefins

A printed circuit board having embedded capacitors includes a double-sided copper-clad laminate including first circuit layers formed in the outer layers thereof, the first circuit layers including bottom electrodes and circuit patterns; dielectric layers formed by depositing alumina films on the first circuit layers by atomic layer deposition; second circuit layers formed on the dielectric layers and including top electrodes and circuit patterns; one-sided copper-clad laminates formed on the second circuit layers; blind via-holes and through-holes formed in predetermined portions of the one-sided copper-clad laminates; and plating layers formed in the blind via-holes and the through-holes. The manufacturing method of the printed circuit board is also disclosed.

Printed circuit board with embedded capacitors therein and manufacturing process thereof

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Seoul, South Korea

Sung Kun Kim