Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Sung-Jun Park

Jin-wook Lee

Myong-jong Kwon

Jong-Guk Kim

Chang-shin Park

Dong-Chul Shin

Sim-Hwan Park

Myung-Gun Chong

Chang-Jae Lee

Tae-Wook Jung

Seon-Hye Kim

Chul-Min Lee

Joong-Mo Hwang

A manufacturing method for a printed circuit board includes: transferring roughness of a metal film to an insulating layer by laminating the metal film on the insulating layer, the metal film having the roughness formed on one surface thereof and having a discrete metal layer laminated thereon; exposing a surface of the insulating layer, on which the roughness is transferred, by removing the metal film; processing the surface of the insulating layer having the roughness formed thereon with an acidic solution; and forming a circuit pattern on the insulating layer by a plating process.

Manufacturing method for printed circuit board

Provided are an inkjet printhead and a method of manufacturing the same. The inkjet printhead may include a substrate having an ink feed passage, a chamber layer formed on the substrate and a plurality of ink chambers fillable with ink supplied from the ink feed hole. The printhead may also include a nozzle layer formed on the chamber layer, which includes a plurality of nozzles through which the ink is ejected and a glue layer interposed between the substrate and the chamber layer. The glue layer may include a cross-linked photoresist composition including photoresist.

Inkjet printhead and method of manufacturing the same

An inkjet printhead and a method of manufacturing the inkjet printhead. In the inkjet printhead, an anti reflective layer is formed of a material absorbing light on a chamber layer, and a nozzle layer including a plurality of nozzles is formed on the anti reflective layer.

Growing community of inventors

Suwon-si, South Korea

Sung-Jun Park