Hypertherm, Inc.

Applied Materials, Inc.

Sung Je Kim

Jesse A Roberts

Shreyansh Patel

Dmitry Lubomirsky

Zheng Duan

Peter J Twarog

Soonam Park

Yu Zhang

Prerna Sonthalia Goradia

Stephen Theodore Eickhoff

Laksheswar Kalita

Ankur Kadam

Dennis M Borowy

Michael F Kornprobst

Yogita Pareek

Justin Gullotta

Bipin Thakur

Qinghua Liu

Jeffrey Cornish

Ashok V Retnaswamy

Josh Murray

Jeffery Cornish

In some aspects, electrodes can include a front portion shaped to matingly engage a nozzle of the plasma cutting system, the front portion having a first end comprising a plasma arc emitter disposed therein; and a rear portion thermally connected to a second end of the front portion, the rear portion shaped to slidingly engage with a complementary swirl ring of the plasma cutting system and including: an annular mating feature extending radially from a proximal end of the rear portion of the electrode to define a first annular width to interface with the swirl ring, the annular mating feature comprising a sealing member configured to form a dynamic seal with the swirl ring to inhibit a flow of a gas from a forward side of the annular mating feature to a rearward side of the annular mating feature.

Cooling plasma cutting system consumables and related systems and methods

An electrode for a plasma arc torch includes a generally cylindrical elongated body formed of an electrically conductive material. The elongated body includes a proximal end that connects to a power supply and a distal end that receives an emissive element. The electrode can include a flange that is disposed about a surface relative to the distal end of the elongated body, extends radially from the surface of the elongated body, and is utilized to establish a uniform gas flow distribution of a plasma gas flow about the distal end of the elongated body. The electrode can include a contact element that is in electrical communication with the proximal end of the electrode. The contact element includes seating portion that has an outer width that is greater than the outermost diameter of the electrode body and is configured to position the contact element within the plasma arc torch.

Apparatus and method for securing a plasma torch electrode

A plasma cutting system is provided. The system includes a power source configured to generate a plasma arc, and a plasma arc torch connected to the power source for delivering the plasma arc to a workpiece. The plasma arc torch defines a multi-function fluid flow path for sustaining the plasma arc and cooling the plasma arc torch such that the plasma cutting system has a power-to-gas flow ratio of at least 2 kilowatts per cubic feet per minute (KW/cfm). The power-to-gas flow ratio comprises a ratio of power of the generated plasma arc to a total gas flow supplied to the plasma arc torch.

Plasma cutting system with efficient components

A process for generating a compact alumina passivation layer on an aluminum component includes rinsing the component in deionized water for at least one minute, drying it for at least one minute, and exposing it to concentrated nitric acid, at a temperature below 10&#xb0; C., for one to 30 minutes. The process also includes rinsing the component in deionized water for at least one minute, drying it for at least one minute, and exposing it to NHOH for one second to one minute. The process further includes rinsing the component in deionized water for at least one minute and drying it for at least one minute. A component for use in a plasma processing system includes an aluminum component coated with an AlOfilm having a thickness of 4 to 8 nm and a surface roughness less than 0.05 &#x3bc;m greater than a surface roughness of the component without the AlOfilm.

Generation of compact alumina passivation layers on aluminum plasma equipment components

A method for conditioning a semiconductor chamber component may include passivating the chamber component with an oxidizer. The method may also include performing a number of chamber process operation cycles in a semiconductor processing chamber housing the chamber component until the process is stabilized. The number of chamber operation cycles to stabilize the process may be less than 10% of the amount otherwise used with conventional techniques.

Conditioned semiconductor system parts

A faceplate or a selectivity modulation device (SMD) for a plasma generation chamber has a plasma resistant ceramic coating on a surface of the faceplate or SMD, wherein the plasma resistant ceramic coating comprises a thickness of less than approximately 30 microns, a porosity of less than 1% and a thickness non-uniformity of less than 4%.

Plasma generation chamber with smooth plasma resistant coating

A nozzle for a plasma arc torch includes a body having a first end and a second end. The nozzle also includes a plasma exit orifice located at the first end of the body. A flange is located at the second end of the body. The flange is adapted to mate with a corresponding consumable. The flange is configured to selectively block at least one gas passage in the corresponding consumable to establish a gas flow relative to the nozzle body.

Torch flow regulation using nozzle features

Growing community of inventors

Santa Clara, CA, United States of America

Sung Je Kim