Samsung Electro-Mechanics Co., Ltd.

Sung Jae Lee

Jung Wook Seo

Sang Jin Kim

Jong Sik Yoon

Chul Min Sim

Hiroyuki Matsumoto

Jong Suk Jung

Byung Jae Kim

Seung Hee Cho

Sung Yong An

Hak Kwan Kim

Kyung Hun Lee

In Cheol Chang

Gab Yong Kim

Won Seo Gu

Young Rok Park

Ji Bum Cha

Sung Jun Byun

Soo Gil Shin

An image sensor module is provided. The image sensor module includes an image sensor which has a rectangular shape having a long side and a short side; a substrate which has a long side corresponding to the long side of the image sensor and a short side corresponding to the short side of the image sensor, wherein the image sensor is mounted on the substrate; a sub-housing installed on the substrate, the sub-housing having a first sidewall disposed on a side corresponding to the long side of the image sensor and a second sidewall disposed on a side corresponding to the short side of the image sensor; and an adhesive which bonds the sub-housing and the substrate, wherein a side surface of the substrate, disposed on the long side of the substrate and an outer surface of the adhesive are disposed on a same plane.

Image sensor module and camera module having the same

An optical image stabilization actuator is provided. The optical image stabilization actuator includes a sensor substrate on which an image sensor having an imaging plane is disposed; a fixed frame configured to accommodate the sensor substrate; a movable frame accommodated in the fixed frame and configured to move in a direction parallel to the imaging plane; a first ball member disposed between the fixed frame and the movable frame and configured to support movement of the movable frame; and a first driver disposed on the movable frame and the fixed frame and configured to provide driving force to the movable frame, wherein the sensor substrate includes a movable portion coupled to the movable frame, a fixed portion coupled to the fixed frame, and a plurality of bridges configured to movably support the movable portion.

Optical image stabilization actuator and camera module including the same

A magnetic powder contains magnetic particles, a first coating layer disposed on surfaces of the magnetic particles and containing a first glass, and a second coating layer disposed on the first coating layer and containing a second glass different from the first glass. A method of manufacturing magnetic powder includes preparing magnetic particles, forming a first coating layer containing a first glass on surfaces of the magnetic particles, and forming a second coating layer containing a second glass different from the first glass on the first coating layer.

Magnetic powder, and manufacturing method thereof

Disclosed herein is a metal magnetic powder, and the metal magnetic powder according to the exemplary embodiment of the present invention includes a soft magnetic core particle and a multilayer coating film covering the core particle and having a multilayer structure, the multilayer coating film including an oxide film formed by heat treating the core particle and an insulation film formed by coating a coating particle with respect to the core particle.

Metal magnetic powder and method for forming the same, and inductor manufactured using the metal magnetic powder

There is provided an image sensor module, including: an image sensor having a small thickness of 175 &#x3bc;m or less and having a first coefficient of thermal expansion; a substrate having the image sensor mounted thereon and having a second coefficient of thermal expansion higher than the first coefficient of thermal expansion; and an adhesive layer disposed between the image sensor and the substrate and including an adhesive having a third coefficient of thermal expansion of 130 ppm/&#xb0; C. or more at a glass transition temperature Tg or more.

Image sensor module and method of manufacturing the same

Disclosed herein is an apparatus for manufacturing a camera module, the apparatus including: a base jig holding a PCB from below; a bonding head picking up an image sensor and attaching the image sensor onto the PCB; and a housing bonding tool picking up a housing assembly and attaching the housing assembly onto the PCB so that the image sensor attached onto the PCB is received in the housing assembly, wherein the base jig is constituted in a structure where the base jig is tension-movable in a vertical direction (Z-axial direction), so that an upper surface of the PCB is an identical reference plane for attaching the image sensor and the housing assembly when the image sensor is picked up by the bonding head and attached onto the PCB.

Apparatus for manufacturing camera module

An apparatus and a method for manufacturing a camera module. The method for manufacturing a camera module includes: picking up an image sensor by the bonding head and mounting the image sensor on a PCB; compensating for a tilt deviation between the PCB and the image sensor by the gyro unit of the PCB support unit simultaneously when the image sensor is mounted on the PCB; applying heat by the heating unit of the bonding head to cure an adhesive applied between the image sensor and the PCB; and after the image sensor is mounted and the adhesive is cured, picking up a lens housing module by a lens housing module pickup unit and mounting the lens housing module on the PCB and attaching contact portions of the PCB to the lens housing module to complete the manufacture of a camera module.

Growing community of inventors

Suwon, South Korea

Sung Jae Lee