Hynix Semiconductor Inc.

Sung Jae Joo

Seok Kiu Lee

Chang Woo Ryoo

Methods for forming thin films of semiconductor devices, and more specifically, methods for forming thin films of semiconductor devices, wherein the semiconductor substrate is subjected to a thin film formation process in a thin film formation apparatus containing a chamber, a susceptor vertically movable in the chamber and a heater disposed within the susceptor, the method comprising a preheating process for stabilizing the internal temperature of the chamber by vertically moving the susceptor a predetermined number of times prior to the thin film formation process.

Method for forming thin films of semiconductor devices

The present invention discloses a method for cleaning a surface of a substrate where a silicon epitaxial layer will be formed before growing the silicon epitaxial layer in a selective epitaxial growth process. Firstly, a high temperature heating element is aligned in a silicon epitaxial layer growth chamber, disposed separated from the substrate, a cleaning gas is inserted into the chamber and is decomposed into an atom or radical state having high reactivity in a gas phase according to heat generation of the high temperature heating element, and is diffused into the substrate, whereby a substrate cleaning reaction is performed at a substrate temperature ranging from 400 to 600&deg; C.

Method for cleaning a substrate in selective epitaxial growth process

A method of selective epitaxial growth for a semiconductor device is disclosed. By employing a hydrogen gas as a selectivity promoting gas in addition to a chlorine gas conventionally used, the method can guarantee the selectivity of epitaxial growth and further increase the growth rate of an epitaxial layer. The method begins with loading a semiconductor substrate into a reaction chamber. The substrate has a mask layer, which is selectively formed thereon to define a first portion exposed beyond the mask layer and a second portion covered by the mask layer. Next, a source gas is supplied into the reaction chamber so that the source gas is adsorbed on the first portion and thus the epitaxial layer is selectively formed on the first portion. Then, the selectivity promoting gas including the H gas into the reaction chamber, whereby any nucleus of semiconductor material is removed from the mask layer. Thereafter, the source gas and the selectivity promoting gas are sequentially and repeatedly supplied until the semiconductor epitaxial layer is grown to a desired thickness.

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Kyoungki-do, South Korea

Sung Jae Joo