Hynix Semiconductor Inc.

Skhynix Inc.

Sung Jae Chung

Byung Soo Park

Hee Youl Lee

Byung Jin Ahn

Sang Tae Ahn

Yung Jun Kim

Won Hyo Cha

Dong Hwan Lee

Jin Gu Kim

Hyun Heo

Seung Won Kim

Hea Jong Yang

Yong Dae Park

Jung Woon Shim

Su Min Yi

Jeong Hyong Yi

A semiconductor device includes stack structures each including a first conductive layer, a substrate disposed under the stack structures, first impurity regions disposed in the substrate, and at least one trench passing through the stack structures and disposed above the first impurity regions.

Semiconductor device and manufacturing method of the semiconductor device

A semiconductor device includes a substrate including a cell region and a peripheral region adjacent to the cell region, a cell stack structure located in the cell region, the cell stack structure including vertical memory strings, a circuit located in the peripheral region, the circuit driving the vertical memory strings, and an interlayer insulating layer formed on the substrate to cover the cell stack structure and the circuit, and including air gaps located between the cell region and the peripheral region.

Semiconductor device

A semiconductor memory device includes a memory block configured to include memory cells coupled to word lines and a peripheral circuit configured to perform a first program operation, a program verifying operation and a second program verifying operation for memory cells coupled to a word line selected from the word lines, and supply program allowable voltages having different levels to selected bit lines of program allowable cells located between program inhibition cells in the first program operation and the second program operation.

Flash memory device and method of programming the same

A program method of a semiconductor memory device may include precharging first bit lines, coupled to first strings, to increase a potential level of the first strings to a first potential level; programming memory cells of a selected word line, wherein the memory cells are coupled to second bit lines; pre-discharging the first bit lines to decrease a potential level of the word lines to a second potential level, wherein the second potential level is lower than the first potential level; and discharging the first bit lines and the word lines to a ground voltage after the pre-discharging.

Program method of semiconductor memory device

A method of erasing a semiconductor memory device comprises grouping a plurality of word lines of each memory block into at least two groups based on intensity of disturbance between neighboring word lines; performing an erase operation by applying a ground voltage to all word lines of a selected memory block and by applying an erase voltage to a well of the selected memory block; and first increasing the ground voltage of one group of the groups to a positive voltage during the erase operation.

Method of erasing semiconductor memory device

A method of programming a non-volatile memory device includes applying a power supply voltage to a drain select line, applying a high level voltage to a drain-side pass word line or a source-side pass word line, and applying a pass voltage to unselected word lines and a program voltage to a selected word line. The high level voltage is applied to the drain-side pass word line or the source-side pass word line before applying the pass voltage to the unselected word lines and the program voltage to the selected word line.

Method of programming non-volatile memory device

A flash memory device has an improved pre-program function. The flash memory device comprises memory cell blocks each including wordlines, bitlines, and memory cells sharing common source lines; an erase controller generating a pre-program control signal in response to an erase command; and a voltage selection circuit selecting one of first and second common source voltages in response to one among the pre-program control signal, a read command, and a program command and outputting the selected voltage to a global common source line.

Flash memory device with improved pre-program function and method for controlling pre-program operation therein

The present invention relates to a flash memory cell and method of manufacturing the same, and programming/erasing/reading method in the flash memory cell. According to the present invention, a source region and a drain region are first formed and a tunnel oxide film is then formed. Therefore, it is possible to prevent damage of the tunnel oxide film due to an ion implantation process. Further, independent two channel regions are formed below the floating gate. Thus, it is possible to store data of two or more bits at a single cell. In addition, the tunnel oxide film, the floating gate and the dielectric film having an ONO structure are formed at a given regions. It is thus possible to reduce the steps of a process and improve an electrical characteristic and integration level of a device.

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Seoul, South Korea

Sung Jae Chung