Samsung Electronics Co., Ltd.

Samsung Electro-Mechanics Co., Ltd.

Sung Il Jo

Hyung Joon Kim

Jinwoo Jung

Seok Hwan Kim

Young Woo Jung

Jung Ho Shim

Hee Tak Shin

An electronic component module includes a semiconductor package having a first surface provided as a mounting surface and a second surface opposing the first surface, and including a semiconductor chip, a component package having a first surface facing the second surface of the semiconductor package, and a second surface opposing the first surface of the component package, the component package including a passive component, and a connector disposed on the second surface of the component package and having a connection surface configured to be mechanically coupled to an external device, the connector including a plurality of connection lines arranged on the connection surface.

Package-on-package and package connection system comprising the same

A memory system includes a nonvolatile memory device and a memory controller. The nonvolatile memory device includes first memory blocks configured to store m-bit data per cell and second memory blocks configured to store n-bit data per cell. The memory controller is configured to control the nonvolatile memory device to close an open word line generated in a second memory block of the second memory blocks when a program operation is performed on the second memory block.

Nonvolatile memory device and method of programming nonvolatile memory device

Growing community of inventors

Suwon-si, South Korea

Sung Il Jo