Samsung Electronics Co., Ltd.

Sung-hyup Kim

Tae-Yeong Kim

Jun-Hyung Kim

Sung-Yong Park

Jun-hyung Kim

Do-hyung Kim

Joon-Ho Lee

Seok-Ho Kim

Jae-hyoung Park

Jae-Hoon Joo

Ho-Jun Kim

Dong-Hoon Han

Sang-Kyu Yoo

Jeong-min Na

Sang-Boo Kang

Jae-Geun Kim

Jai-hyung Won

Ki-ju Sohn

Kwang-Sung Lee

Hyun-Joo Jeon

Kyeong-Bin Lim

Sung-Gwang Lee

A substrate bonding apparatus includes a substrate susceptor to support a first substrate, a substrate holder over the substrate susceptor to hold a second substrate, the substrate holder including a plurality of independently moveable holding fingers, and a chamber housing to accommodate the substrate susceptor and the substrate holder.

Method of bonding substrates utilizing a substrate holder with holding fingers

Apparatus for bonding substrates having a substrate holder with holding fingers and method of bonding substrates

A wafer bonding apparatus includes a first bonding chuck to fix a first wafer on a first surface thereof, a second bonding chuck to fix a second wafer on a second surface thereof facing the first surface, a bonding initiation member at a center of the first bonding chuck to push the first wafer towards the second surface, and a membrane member including a protrusion protruding from a center portion of the second surface towards the first surface, and a planar portion defining the protrusion on an outer region surrounding the center portion.

Wafer bonding apparatus and wafer bonding system using the same

A megasonic cleaner includes a water tank that includes a pair of opposite inner walls and a bottom wall connected thereto, and that accommodates a fluid therein; a plurality of supporting units arranged in the water tank at predetermined positions that support a wafer; and at least one transducer arranged on the bottom wall that transmits energy in the form of waves into the fluid, where each of the opposite inner walls has a first protrusion that protrudes into an internal space of the water tank, the first protrusion being spaced above the bottom wall and positioned at an height that is greater than or equal to a height of the centers of the plurality of supporting units.

Megasonic cleaner

A spin coater includes a rotatable chuck structure configured to hold a substrate, a bowl enclosing the substrate and guiding a flow of a fluid around the substrate to a bottom of the bowl, and a flow controller detachably coupled to the bowl such that the flow controller is arranged between the bowl and an edge of the substrate and separates the flow into a linear flow and a non-linear flow.

Spin coater and substrate treating apparatus having the same

A wafer to wafer bonding method includes performing a plasma process on a bonding surface of a first wafer, pressurizing the first wafer after performing the plasma process on the bonding surface of the first wafer, and bonding the first wafer to a second wafer. The plasma process has different plasma densities along a circumferential direction about a center of the first wafer. A middle portion of the first wafer protrudes after pressurizing the first wafer. The first wafer is bonded to the second wafer by gradually joining the first wafer to the second wafer from the middle portion of the first wafer to a peripheral region of the first wafer.

Wafer to wafer bonding method and wafer to wafer bonding system

A substrate bonding apparatus and a method of bonding substrates, the apparatus including an upper chuck securing a first substrate onto a lower surface thereof such that the first substrate is downwardly deformed into a concave surface profile; a lower chuck arranged under the upper chuck and securing a second substrate onto an upper surface thereof such that the second substrate is upwardly deformed into a convex surface profile; and a chuck controller controlling the upper chuck and the lower chuck to secure the first substrate and the second substrate, respectively, and generating a shape parameter for changing a shape of the second substrate to the convex surface profile from a flat surface profile.

Substrate bonding apparatus

An apparatus for clamping a probe card may include a body portion, an inner clamping portion and a plurality of outer clamping portions. The body portion may be arranged between a printed circuit board (PCB) of the probe card and a test head. The inner clamping portion may be integrally formed with an upper surface of the body portion. The inner clamping portion may be configured to affix a central portion of the PCB to the test head. The outer clamping portions may be integrally formed with side surfaces of the body portion. The outer clamping portions may be configured to affix a portion surrounding the central portion of the PCB to the test head. Thus, a contact area between the clamping apparatus and the PCB may be increased.

Apparatus for clamping a probe card and probe card including the same

A semiconductor process management system is provided. The semiconductor process management system includes a communicator that receives a process recipe from one or more process apparatuses and receives a measured value for each sampling point from one or more measuring apparatus, and a first determination unit that establishes a mutual influence model between the process recipe and the measured value for each sampling point based on the process recipe and the measured value for each sampling point.

Semiconductor process management system, semiconductor manufacturing system including the same, and method of manufacturing semiconductor

Growing community of inventors

Hwaseong-si, South Korea

Sung-hyup Kim