Samsung Electronics Co., Ltd.

Sung Hwi Cho

Sung-Yeol Kim

Sung Yong Lim

Mee Hyun Lim

Woong Jin Cheon

Seong Ha Jeong

A substrate processing apparatus is provided. The substrate processing apparatus includes a chamber comprising a support, the support configured to have mounted thereon a substrate; at least one channel disposed in the chamber and into which a conductive fluid or a non-conductive fluid is configured to be injected; and a control unit. The control unit includes a first pump and a second pump configured to respectively supply the conductive fluid and the non-conductive fluid to the at least one channel; and a first valve configured to receive the conductive fluid and the non-conductive fluid from the first pump and the second pump, respectively, and control proportions at which the conductive fluid and the non-conductive fluid are injected into the at least one channel.

Growing community of inventors

Gwangju-si, South Korea

Sung Hwi Cho