Samsung Electronics Co., Ltd.

Sung-Hwan Yoon

Jin-Ho Kim

In-Ku Kang

Sang-Wook Park

Min-Young Son

Se-Yong Oh

Sang-Hyeop Lee

Min-Keun Kwak

Chan-Suk Lee

Tae-Duk Nam

Beung-Seuck Song

A semiconductor chip package includes a lead frame, an insulation member, a chip, bonding wires and a sealing member. The lead frame includes a plurality of first leads and a plurality of second leads. The second leads have a chip adhesion region. The insulation member fills a space between the second leads in the chip adhesion region. The chip is provided on at least one surface of the insulation member. The chip has single-side bonding pads. The bonding wires electrically connect the leads and the bonding pads. The sealing member covers the lead frame, the insulation member, the chip and the bonding wires. Since the space between the second leads is filled with the insulation member, voids may be prevented from occurring.

Semiconductor chip package

Provided are a stack package and a stack packaging method. The stack package includes: a first package; and a second package stacked on the first package, wherein external leads of the first package and the second package are directly connected to one another and inner leads thereof are arranged in different shapes so that the Chip Select signal of the second package are input through a No Select pin of the first package.

Stack package and stack packaging method

Embodiments of the inventive concept provide a semiconductor chip stack-type package. The package comprises a lead frame including a die paddle part and a lead part, a first semiconductor chip group and a second semiconductor chip group stacked sequentially and mounted on one surface of the die paddle part, a first wiring board between the first semiconductor chip group and the second semiconductor chip group, and second semiconductor chip group bonding wires for electrically connecting the second semiconductor chip group to the first wiring board. End portions of the first wiring board are electrically connected to inner leads of the lead part, which is adjacent to the die paddle part.

Semiconductor chip stack-type package and method of fabricating the same

Provided is a thin semiconductor package comprising a semiconductor chip and a lead frame, the lead frame including a paddle portion configured for mounting the semiconductor chip in a manner that exposes bonding pads within an aperture formed in a center portion of the lead frame and a peripheral terminal pad portion for establishing external contacts. A plurality of bonding wires are used to establish electrical connection between a lower surface of the paddle part and corresponding bonding pads with intermediate leads providing connection to the terminal pad portions. The semiconductor chip, lead frame and bonding wires may then be encapsulated to form a thin semiconductor package having a thickness substantially equal to that of the terminal pad portions. The thin semiconductor packages may, in turn, be used to form multi-chip stack packages using known good semiconductor chips to form a high-density compound semiconductor packages.

Thin semiconductor package having stackable lead frame and method of manufacturing the same

The present invention provides an LOC package wherein the lead frame is in direct contact with the semiconductor device. The lead frame, which includes openings, is positioned directly on the semiconductor device. An adhesive material is applied in the opening in the lead frame. This adhesive material contacts both the lead frame and the semiconductor device. The lead frame is therefore securely held to the semiconductor device. Wires can then be bonded to contact pads on the semiconductor device and to the lead frame.

Lead on chip semiconductor package

A semiconductor package comprises a substrate having connection pads disposed thereon, a semiconductor chip attached to the substrate such that an active surface of the semiconductor chip faces the substrate, and external bonding pads electrically connected to the active surface of the semiconductor chip. The external bonding pads may be formed near the ends of the frame and have an upper surface facing away from the substrate. The external bonding pads are electrically connected with the connection pads.

Growing community of inventors

Chungcheongnam-do, South Korea

Sung-Hwan Yoon