Apple Inc.

Mie Fujitsu Semiconductor Limited

Silicon Graphics, Incorporated

Williams-Sonoma, Inc.

Suvolta, Inc.

Think Outside, Inc.

Sung Hwan Kim

Jonathan P Ive

Arturo Meuniot

Bartley K Andre

Christopher J Stringer

Steve P Jobs

Michael D McBroom

Joel Frederic Jensen

Daniel Lynn McBroom

Michael D Hillman

Brian Thomas Sudderth

Russell C Mead, Jr

Frank Tsai

Robert Burton Brownell, Jr

Arthur Stanley Brigham

Anwyl M McDonald

Jesus Beltran

Tang Yew Tan

Lucian Shifren

Scott E Thompson

Pushkar Ranade

Thomas Hoffmann

Sameer S Pradhan

Teymur Bakhishev

Dalong Zhao

Michael Duane

Lingquan Wang

Yujie Liu

Erik L Wang

Robert Sean Murphy

Lawrence E Davis

Jeffrey Eugene Neaves

Robert D Brunner

Daniele De Iuliis

Daniel J Coster

Peter Michael Cazalet

John Gee Tang

Yuan Chen

Lance A Scudder

Douglas Lea Heirich

Weimin Zhang

Ricardo Alba Mariano

Dominic P Symons

Robert Olodort

Jing Wang

Daniel J Riccio

Sachin R Sonkusale

Paul E Gregory

Christopher N Lenart

Steven G Siefert

Steven W Holmes

Benjamin Pei-Ming Chia

Pei-En Chang

Hossein Nemati

Chia Hsuan Tai

Chiew-Siang Goh

Ronald Jack Smith

Brian J Ray

Thomas J Misage

Jeremy Yaekel

Tae Woon Cha

Diego G Andina

Michael J Dolan

Gianpiero Tonetti

Mark E Bartholomew

Colin Alexander Davis

Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves.

Ejectable component assemblies in electronic devices

An electronic device may have a housing and a display in the housing. The display may have one or more curved edges such as curved edges associated with rounded corners in the display and housing. The display may have an array of pixels. The display may include full-strength pixels and may have a band of antialiasing pixels having selectively reduced strengths to visually smooth content displayed along the curved edges. The antialiasing pixels may include single-opening pixels that each have a single opaque masking layer opening and may include dual-opening pixels that each include a pair of opaque masking layer openings. The single-opening pixels may be stronger than the dual-opening pixels.

Pixel array antialiasing to accommodate curved display edges

A transistor and method of fabrication thereof includes a screening layer formed at least in part in the semiconductor substrate beneath a channel layer and a gate stack, the gate stack including spacer structures on either side of the gate stack. The transistor includes a shallow lightly doped drain region in the channel layer and a deeply lightly doped drain region at the depth relative to the bottom of the screening layer for reducing junction leakage current. A compensation layer may also be included to prevent loss of back gate control.

Method for fabricating a transistor with reduced junction leakage current

Quick release couplings for releasably coupling components to the computer are disclosed. The quick release coupling mechanisms are generally configured to allow tool-less placement of the components relative to the computer. That is, the quick release coupling mechanisms are configured to perform their couplings without using conventional fasteners such as screws, bolts, etc. By eliminating use of fasteners, the components may be inserted and removed from the computer without using tools (e.g., tool-less). Furthermore, the quick release couplings are easy to maneuver thereby enabling quick and straightforward assembly and disassembly of the components to and from the computer (e.g., quick release). For example, the components may be inserted and removed by a simple pushing or pulling motion, and/or by a simple flick of a latch or handle.

Quick release structures for a memory drive

High uniformity screen and epitaxial layers for CMOS devices

A semiconductor transistor structure fabricated on a silicon substrate effective to set a threshold voltage, control short channel effects, and control against excessive junction leakage may include a transistor gate having a source and drain structure. A highly doped screening region lies is embedded a vertical distance down from the surface of the substrate. The highly doped screening region is separated from the surface of the substrate by way of a substantially undoped channel layer which may be epitaxially formed. The source/drain structure may include a source/drain extension region which may be raised above the surface of the substrate. The screening region is preferably positioned to be located at or just below the interface between the source/drain region and source/drain extension portion. The transistor gate may be formed below a surface level of the silicon substrate and either above or below the heavily doped portion of the source/drain structure.

Deeply depleted MOS transistors having a screening layer and methods thereof

Transistor having reduced junction leakage and methods of forming thereof

Display device with a moveable assembly

Growing community of inventors

San Jose, CA, United States of America

Sung Hwan Kim