Cheil Industries Inc.

Sung-Hwan Cha

Sang-Ran Koh

Woo-Han Kim

June-Ho Shin

Hyun-Jung Ahn

Ha Neul Kim

Chi Won An

Young-Eun Choi

Yong Kook Kim

Sang-Kyun Kim

Jong-Seob Kim

Doo-Young Jung

A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si&#x2014;H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si-Vi) at its terminal end, wherein a ratio (Si&#x2014;H/Si-Vi) of hydrogen bound to silicon (Si&#x2014;H) in the first polysiloxane to the alkenyl group bound to silicon (Si-Vi) in the second polysiloxane is about 1 to about 1.

Resin for transparent encapsulation material, and associated encapsulation material and electronic device

A polyorganosiloxane composition, an encapsulation material, and an electronic device, the polyorganosiloxane composition including a linear first polyorganosiloxane resin including a moiety represented by the following Chemical Formula 1 and a moiety represented by the following Chemical Formula 2, the first polyorganosiloxane resin including double bonds at both terminal ends thereof, and a second polyorganosiloxane resin having a three dimensional network structure, 

Polyorganosiloxane, encapsulation material obtained from the polyorganosiloxane, and electronic device including the encapsulation material

A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si&#x2014;H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si&#x2014;Vi) at its terminal end, wherein a ratio (Si&#x2014;H/Si&#x2014;Vi) of hydrogen bound to silicon (Si&#x2014;H) in the first polysiloxane to the alkenyl group bound to silicon (Si&#x2014;Vi) in the second polysiloxane is about 1 to about 1.

A transparent resin for an encapsulation material, including a polymetallosiloxane obtained from at least one metal compound represented by Chemical Formulae 1A to 1D copolymerized with a silicon compound including a compound represented by Chemical Formula 2: 

Transparent resin for encapsulation material and electronic device including the same

A resin composition for a transparent encapsulation material, the resin composition including a polysiloxane obtained by copolymerization of a first silicon compound represented by the following Chemical Formula 1 and a second silicon compound including a compound represented by the following Chemical Formula 2, 

Resin composition for transparent encapsulation material and electronic device formed using the same

A hybrid siloxane polymer, an encapsulant, and an electronic device, the hybrid siloxane polymer including a linear first siloxane resin including moieties represented by the following Chemical Formulas 1a and 1b, the first siloxane resin including double bonds at both terminal ends thereof, and a second siloxane resin having a reticular structure: 

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Uiwang-si, South Korea

Sung-Hwan Cha