Advanced Semiconductor Engineering, Inc.

Sung-Hung Chiang

Yu-Chang Chen

Hao-Chih Hsieh

Tun-Ching Pi

Chang-Lin Yeh

Jen-Chieh Kao

Yi Chen

A semiconductor device package includes a number of interposers mounted to the carrier, wherein the number of interposers may be arranged in an irregular pattern.

Semiconductor device package

A semiconductor device package includes a carrier, a first interposer disposed and a second interposer. The second interposer is stacked on the first interposer, and the first interposer is mounted to the carrier. The combination of the first interposer and the second interposer is substantially T-shaped.

A semiconductor device package includes a substrate, a package body, a via and an interconnect. The substrate includes a surface and a pad on the first surface. The package body covers at least a portion of the surface of the substrate. The via is disposed in the package body and includes a conductive layer and a first intermediate layer. The conductive layer is electrically connected with the pad. The first intermediate layer is adjacent to the conductive layer. The interconnect is disposed on the first intermediate layer.

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Kaohsiung, Taiwan

Sung-Hung Chiang