Taiwan Semiconductor Manufacturing Comp. Ltd.

Springsoft Usa, Inc.

Sung-Han Tsai

Li-Jui Chen

Fong-Yuan Chang

Hsin-Po Wang

Chueh-Chi Kuo

Yen-Hao Liu

Yu-Sheng Lu

Chun-Cheng Chi

Hsueh Liang Hsu

Yi-Der Lin

Ru Lin Yang

A cleaning device for cleaning particles from a tool includes a nozzle structure having a spray opening to spray a cleaning liquid in a first direction to the tool, a cleaning pad disposed around the nozzle structure, and a support disposed around the cleaning pad. The cleaning pad exposes the spray opening and includes a front surface facing in the first direction to clean the tool. The support includes multiple gas openings to blow a pressurized gas in the first direction to the tool, and multiple vacuum openings to suck residual gas, liquid and particles around the tool. An air wall around the tool is thus generated by a combination of operations performed by the multiple gas openings and the multiple vacuum openings to reduce or prevent contamination that might be caused by the cleaning device in the chamber.

Onsite cleaning system and method

An engineering change order (ECO) modifying an IC having spare cell instances is implemented by converting active cell instances implementing portions of the IC to be deleted into additional spare cell instances, by creating a technology independent behavioral model of portions of the IC to be added, by selecting spare cell instances to implement the behavior model, and by routing nets to the selected spare cell instances in a way that minimizes a number of metal layers of the IC that are modified.

System for implementing post-silicon IC design changes

Growing community of inventors

Taichung, Taiwan

Sung-Han Tsai