Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Samsung Sdi Co., Inc.

Seoul Viosys Co., Ltd.

Seoul Opto Device Co., Ltd.

Coupang, Corporation

Lg Electronics Inc.

Nutrex Technology Co., Ltd.

Hp Printing Korea Co., Ltd.

Sung Han Kim

Jae Hyuk Jang

Jae Hyoung Gil

Chung Hoon Lee

James Stephen Speck

Jae Ho Lee

Jung Hyo Lee

Hong San Kim

Si Kyun Park

Jae Jo Kim

Jin Hee Choi

Han Bit Kim

Kyoung Ku Kang

Ju Ho Kim

Tae Sung Jeong

Se Hyun Park

Jong Ho Chung

Seong Heun Cho

Eon Soo Lee

Kyung Ho Lee

Seok Hwan Kim

Yun Tae Lee

Jong Sik Yoon

Chul Kyu Kim

Kyung Bae Park

Seung Won Lee

Sung Young Yun

Yong Il Kwon

Ki Pyo Hong

Young Bok Yoon

Wook Su Lee

Kang Heon Hur

Young Gwan Ko

Chul Joon Heo

Myung Sam Kang

Sang Jin Kim

Sang Ho Lee

Seon-Jeong Lim

Bon Seok Koo

Sang Hyun Shin

Eun Su Lee

Joo Hui Kim

Masazumi Amagai

Nak Hyun Sung

Young Soo Oh

In Cheol Jeon

Sang Beom Kim

Kyong Bok Min

Ji Ho Chang

Hong Ryul Lee

Kyoung Hoon Kim

Han Sham Jeon

Ho Youn Son

Sung Gu Yu

Tae Ho Yun

Kyung Moon Jung

Jong Man Kim

Hyun Cheol Jeong

Min Hye Kim

Ro Woon Lee

Sa Yong Lee

Eun Sil Kim

Kyu Ok Choi

Seok Hwan Ahn

Jin Ho Hong

Yong Jun Kim

Keun Yong Lee

Se Yeon Hwang

Ji Won Moon

Joong Hun Kim

Han Sung Yu

Kyung Hoon Min

Ho Jin Jang

Joon Woo Gi

Sung Yul Yoo

Sang Yul Ha

Jae Woo Yeo

Jun Yong Jang

Hyun Wook Lee

Da Le Ahn

Jie Zhou

Dong Cheol Shin

Jong Gil Won

Joo Hwan Noh

Yun Kyu Sim

Yun Hi Kim

Soon Ki Kwon

Chunyan Li

Chang Hun Cho

A fan-out semiconductor package includes connection pads of a semiconductor chip that are redistributed and electrically connected to connection terminals by an interconnection member. In the fan-out semiconductor package, disposition forms of vias and pads in the interconnection member are designed so that stress may be reduced, such that reliability is improved.

Fan-out semiconductor package

A thermoelectric module includes a stack structure of a plurality of insulating layers, a plurality of thermoelectric elements formed with the insulating layer interposed therebetween and including a first-type semiconductor device, a second-type semiconductor device, a first electrode connected to the first-type semiconductor device, a second electrode connected to the second-type semiconductor device, and a connection electrode connecting the first-type and second-type semiconductor devices, and a conductive via penetrating through the insulating layer to connect thermoelectric elements adjacent to each other, among the plurality of thermoelectric elements.

Thermoelectric module and method for manufacturing the same

An operating method of an electronic apparatus for detecting misdelivery may comprise: monitoring a location of a courier terminal using at least one of first location information, second location information, and third location information; obtaining delivery completion information from the courier terminal; and detecting misdelivery of an item by a courier based on a delivery address and the location of the courier terminal. Accordingly, the electronic apparatus may induce correct delivery to the courier by determining misdelivery of the item based on the location of the courier and the delivery address.

Electronic apparatus and operation method thereof

An electronic device includes a display panel and a biometric sensor. The display panel includes a light emitter. The biometric sensor is stacked with the display panel and is configured to detect light emitted from the display panel and reflected by a recognition target that is external to the electronic device. The biometric sensor includes a silicon substrate and a photoelectric conversion element on the silicon substrate. The photoelectric conversion element includes a photoelectric conversion layer having wavelength selectivity.

Electronic devices

An optical assembly includes: a camera module; at least one actuator configured to move the camera module; and a connection substrate having one end connected to the camera module such that at least a portion of the connection substrate is configured to move along with movement of the camera module. The connection substrate includes a rigidity reduction portion reducing rigidity of the connection substrate in a portion of the substrate in which distortion or warpage occurs according to the movement of the camera module.

Optical assembly

A method of generating search results, comprising; receiving, by a computing system, an instruction to generate search results relating to a SKU stored in a database; extracting, by the computing system, a context based on information relating to the SKU; generating, by the computing system, a dynamic search string, by: generating a key based on the instruction; identifying a dictionary based on the context, the dictionary containing a plurality of dictionary term; and generating the dynamic search string by determining the dictionary term corresponding to the key; searching, by the computing system, using the dynamic search string, in content data; returning results from the content data matching the dynamic search string; and generating for display on a client device, the results.

Generating context relevant search results

The present invention relates to a method for processingat an ultra high pressure, and more particularly, to a method for processingthat is capable of processing the, which is immersed and packed, at an ultra high pressure. The method for processingincludes the steps of: preparing washed; liquid-packaging theinto a pouch; and treating the liquid-packagedwith ultra-high pressure at a pressure of 550 to 600 MPa for 30 seconds to 2 minutes.

Method for processing ginseng with ultra-high pressure

A secondary battery having an improved current-collecting structure is provided. In an example embodiment, the secondary battery includes an electrode assembly including a plurality of unit electrode plates each including a pair of non-coating portion tabs at a first side and a plurality of separators each located between the unit electrode plates; and a current collector plate welded to the non-coating portion tabs, and the current collector plate is welded in a state in which the pair of non-coating portion tabs are bent in opposite directions. The pair of non-coating portion tabs are bent in opposite directions to then be welded to the current collector plate, and welding may be complementarily performed, thereby securing electrical stability.

Secondary battery having improved current-collecting structure

The present invention relates to a display film and, more particularly, to a display film comprising a substrate layer and a coating layer formed on one surface of the substrate layer, wherein a first critical radius of curvature measured in a direction in which the side surface of the coating layer becomes concave is at most about 10 mm, and a second critical radius of curvature measured in a direction in which the side surface of the substrate layer becomes concave is at most about 5 mm. The display film according to the present invention has a high surface hardness while exhibiting superior flexibility in both directions vertical to the plane direction of the film and thus is suitable for application as an outer window film for a display and particularly has the property of being applicable to a flexible display.

Display film and display device comprising same

A window film and a flexible display including the same. The window film includes a base layer, a window coating layer on a surface of the base layer, and a back coating layer on another surface of the base layer, wherein the window coating layer is formed from a composition for window coating layers comprising a silicon-based resin, and the window film has an elastic modulus of about 1,000 Mpa or more on the back coating layer and has a pencil hardness of about 6H or higher on an adhesive layer.

Window film and flexible display including the same

A fan-out semiconductor package includes: a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads; a passivation layer disposed on the connection member and having openings exposing at least portions of the redistribution layer; metal members disposed in the openings of the passivation layer and connected to the exposed redistribution layer; and electrical connection structures disposed on the passivation layer and connected to the metal members, wherein the electrical connection structures have heights hierarchically differentiated from one another depending on sizes of the metal members.

Provided are: a composition for a window film, containing a siloxane resin including chemical formula 1 below and an iodonium ion-containing photo-cationic initiator; a flexible window film formed therefrom; and a flexible display device comprising the same. Chemical formula 1: (RSiO)(RRSiO).

Composition for window film, flexible window film formed therefrom, and flexible display device comprising same

Growing community of inventors

Suwon-si, South Korea

Sung Han Kim