Amkor Technology Singapore Holding Pte. Ltd.

Amkor Technology, Inc.

Other

Sung Gyu Kim

Tae Yong Lee

Kyoung Yeon Lee

Doo Soub Shin

Byong Jin Kim

Gi Jeong Kim

A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.

Semiconductor package with EMI shield and fabricating method thereof

The present invention relates to a visor cap. It is an aim of the present invention to provide a visor cap which can widen a sun blocking area through variable visors and which enables a wearer to adjust the sun-blocking area while improving wearing comfort. To accomplish the aim, provided is a visor cap including a main body, a fixed visor, and a pair of variable visors hinged to both sides of an upper surface or a lower surface of the fixed visor, so as to vary the sun-blocking area, wherein each of the pair of variable visors includes: a first variable visor portion which is made of a textile material and one side of which is fixed at an edge of the fixed visor; and a second variable visor portion which is made of a synthetic resin material and which is coupled to the other side of the first variable visor portion. The visor cap of the present invention is advantageous in that it enables a wearer to adjust the sun-blocking area if needed, and is prevented from contacting the skin of the wearer, thus improving is wearing comfort while expanding the sun-blocking area.

Visor cap having variable visors

In one embodiment, a semiconductor device includes a leadframe structure. A semiconductor die is attached to a die pad. Land connect bars are spaced apart from the die pad and a plurality of lands are between the land connect bars and the die pad and are spaced apart therefrom. Insulation members are adhered to the land connect bars and the plurality of lands to hold the land connect bars and the plurality of lands together and to electrically isolate them. An encapsulant covers the semiconductor die and at least portions of the plurality of lands, the die pad, and the land connect bars and further fills spaces between the land connect bars and the plurality of lands.

Electronic package structure with insulated adhesion portion for affixing and isolating lands spaced apart from land connect bar within a leadframe

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Seoul, South Korea

Sung Gyu Kim