Samsung Electronics Co., Ltd.

Samsung Electro-Mechanics Co., Ltd.

Sung-gyu Kang

Jae-woo Chung

Young-ki Hong

Joong-hyuk Kim

Seung-ho Lee

Yong-wan Jin

Seung-mo Lim

Jae-Chang Lee

Chang-seung Lee

Jae-joon Choi

Jin-seok Hong

Ki Bang Lee

Kyo-yool Lee

Seung-Ho Lee

Su-ho Shin

Tae-Woon Cha

Hee-moon Jeong

Kyung-Il Cho

Kyu-yong Kim

You-seop Lee

Young-Ki Hong

Hwa-sun Lee

Se-young Oh

Chang-hoon Jung

Kae-dong Back

Byeoung Ju Ha

In-seob Song

Hayong Yun

Sang-young Son

Hee-Moon Jeong

Disclosed is a method of forming an electric wiring using inkjet printing. The method includes forming a main trench and first and second guide trenches on a substrate. The first and second guide trenches are disposed at opposite sides of the main trench. The method includes ejecting ink into the main trench, the ink including a conductive material. The method also includes heating the substrate to sinter the ink such that the electric wiring is formed an upper portion of the main trench, and contract the ink such that a tunnel is formed in a lower portion of the main trench.

Method of forming electric wiring using inkjet printing

A printing apparatus includes: a flow channel plate including, a pressure chamber, a nozzle including an outlet through which ink contained in the pressure chamber is ejected, and a trench disposed around the nozzle, and the outlet extending into the trench; a piezoelectric actuator configured to provide a change in pressure to eject the ink contained in the pressure chamber; and an electrostatic actuator configured to provide an electrostatic driving force to the ink contained in the nozzle.

Printing system, printing apparatuses, and methods of forming nozzles of printing apparatuses

A method of forming a wiring may include forming a first wire on a substrate; forming a material layer on the substrate, except on the first wire; forming a surface treatment film on the material layer; and forming a second wire on the first wire. The surface treatment film has physical properties opposite to the first wire. A method of forming a wiring may include forming a first wire on a substrate; forming a material layer on the substrate and the first wire; removing a portion of the material layer from the first wire; forming a surface treatment film on the material layer and the first wire; removing a portion of the surface treatment film from the first wire; and forming a second wire on the first wire. A thickness of the material layer on the substrate is greater than a thickness of the first wire on the substrate.

Methods of forming wirings in electronic devices

An inkjet printing device includes a flow path plate comprising a manifold to supply ink, a pressure chamber filled with the ink supplied from the manifold, and a nozzle via which the ink is ejected, a piezoelectric actuator which is disposed on a top surface of the flow path plate and includes a lower electrode, a piezoelectric layer, and an upper electrode that are stacked sequentially, a first electrostatic electrode to generate an electrostatic field, and a second electrostatic electrode which is disposed a predetermined distance apart from a bottom surface of the flow path plate to generate the electrostatic field between the first electrostatic electrode and the second electrostatic electrode.

Inkjet printing device and method of driving the same

A method of forming patterns on a substrate, the method including: placing a mask having an opening defining a portion of one surface of a substrate on which patterns are to be formed on the substrate; forming a first modification layer in the opening by ejecting a surface modification ink onto a surface of the substrate through the opening; ejecting a target ink having droplets of sizes larger than those of a surface modification ink such that the target ink is distributed on the first modification layer in the opening; and removing the mask.

Methods of forming patterns on a substrate

Provided is an inkjet printing apparatus. The inkjet printing apparatus includes a nozzle. The nozzle includes at least two nozzle parts. A first of the at least two nozzle parts has a first tapered shape, and a second of the at least two nozzle parts has a second tapered shape and extends from the first nozzle part. The first and second tapered shapes have a same taper direction.

Inkjet printing apparatuses, inkjet nozzles, and methods of forming inkjet nozzles

A printing apparatus includes a first nozzle substrate having a first tapered nozzle unit aligned with a pressure chamber and a second nozzle substrate having a second tapered nozzle unit aligned with the first tapered nozzle unit and attached to the bottom of the first nozzle substrate.

Inkjet printing apparatus and method of forming nozzles

Provided is an inkjet printing device. The inkjet printing device includes a passage forming substrate having a plurality of pressure chambers and a nozzle substrate. The nozzle substrate includes a plurality of nozzle blocks extending in a first direction, a plurality of nozzles connected to the pressure chambers and penetrating the nozzle blocks, and a plurality of trenches. Each of the trenches is disposed in a second direction perpendicular to the first direction with respect to the nozzle blocks, recessed from a bottom surface of the nozzle blocks, and extends in the first direction.

Inkjet printing devices for reducing damage during nozzle maintenance

A method of manufacturing a piezoelectric inkjet printhead includes processing a lower silicon-on-insulator substrate having a sequentially stacked structure with a first silicon layer, an intervening oxide layer, and a second silicon layer, processing the lower silicon-on-insulator substrate by etching the second silicon layer to form a manifold, a plurality of pressure chambers arranged along at least one side of the manifold and connected with the manifold, and a plurality of dampers connected with the pressure chambers, and by etching the first silicon layer and the intervening oxide layer to form a plurality of vertical nozzles through the first silicon layer and the intervening oxide layer to corresponding ones of the plurality of dampers, stacking and bonding an upper substrate on the lower substrate, reducing the upper substrate to a predetermined thickness, and forming a piezoelectric actuator on the upper substrate.

Piezoelectric inkjet printhead and method of manufacturing the same

A nozzle plate including protruding nozzles and a method of manufacturing the nozzle plate. The nozzle plate may include a body unit and at least one nozzle protruding from the body unit. The at least one nozzle may include an exit part having a constant cross-sectional area and a damper part having a cross-sectional area that decreases in a direction toward the exit part, wherein the damper part of the at least one nozzle includes a plurality of inner wall surfaces having different angles of inclination.

Nozzle plate and method of manufacturing the same

Provided are a nozzle plate and a method of fabricating the nozzle plate. In accordance with an example embodiment of the present invention, a nozzle plate may include a body and at least one nozzle protruding from the body, wherein the at least one nozzle includes a wall having a thickness that increases the farther the wall gets away from an exit of the at least one nozzle.

Provided is a nozzle plate and methods of manufacturing the nozzle plate. The nozzle plate may include a substrate having a nozzle. The nozzle plate may also include a permittivity reducing area in an upper portion of the substrate around the nozzle, wherein the permittivity reducing area includes a plurality of porosities and a plurality of walls between the plurality of porosities. Additionally, the nozzle plate may include a protection layer on the substrate, wherein the protection layer covers the plurality of porosities and the plurality of walls.

A method of manufacturing a thin film transistor includes sequentially forming a gate and at least one insulation layer on a substrate, forming a source electrode and a drain electrode on the at least one insulation layer, and forming a channel layer formed of a semiconductor on a part of the source electrode and the drain electrode, wherein the gate, the source electrode, and the drain electrode are formed by using a hybrid inkjet printing apparatus.

Method of manufacturing TFT and array TFT

A method of forming a hydrophobic coating layer on a surface of a nozzle plate of an inkjet printhead includes forming a plurality of nozzles in the nozzle plate, each of the nozzles having an exit, stacking a film on the surface of the nozzle plate to cover the exit of each of the nozzles, forming a predetermined metal layer on an inner wall of each of the nozzles and an inner surface of the film covering the exit of each of the nozzles using a plating method, removing the film from the surface of the nozzle plate, forming a hydrophobic coating layer on the surface of the nozzle plate to cover the metal layer exposed through the exit of each of the nozzles, and removing the metal layer formed on the inner wall of each of the nozzles and the hydrophobic coating layer formed on the surface of the metal layer.

Growing community of inventors

Suwon-si, South Korea

Sung-gyu Kang