Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Sung Geun Kang

Jong Sik Paek

Doo Hyun Park

Yong Min Song

Wang Gu Lee

Pil Je Sung

Seong Min Seo

Seo Yeon Ahn

Eun Young Lee

Do Hyung Kim

Won Chul Do

In Bae Park

Jin Hee Park

Chang Min Lee

A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide methods for manufacturing a semiconductor device, and semiconductor devices produced thereby, that comprise forming an interposer including a reinforcement layer.

Semiconductor device and manufacturing method thereof

In one embodiment, a semiconductor package includes a semiconductor die having conductive pads. A lead frame is directly connected to the conductive pads using an electrochemically formed layer or a conductive adhesive layer thereby facilitating an electrical connection between the conductive pads of the semiconductor die and the lead frame without using separate wire bonds or conductive bumps.

Semiconductor package with semiconductor die directly attached to lead frame and method

A method for a semiconductor device utilizing redistribution layers to couple stacked die is disclosed and may include bonding a first semiconductor die to a second semiconductor die, the first semiconductor die having a first surface comprising bond pads, a second surface opposite the first surface that is bonded to a first surface of the second semiconductor die, and sloped sides surfaces between the first and second surfaces of the first semiconductor die, such that a cross-section of the first semiconductor die is trapezoidal in shape. A passivation layer may be formed on the first surface and sloped side surfaces of the first semiconductor die and the first surface of the second semiconductor die. A redistribution layer may be formed on the passivation layer formed on the first surface and sloped side surfaces of the first semiconductor die and the first surface of the second semiconductor die.

Semiconductor device utilizing redistribution layers to couple stacked die

Growing community of inventors

Bucheon-si, South Korea

Sung Geun Kang