Hercules Corporation

Sung G Chu

Harold Jabloner

Tuyen T Nguyen

Brian J Swetlin

Alan E Goliaszewski

Hong Yang

Feng Gao

Thomas J Podlas

Teng-Shau Young

Dirk Kruythoff

Norman E Daughenbaugh, Jr

Dekai Loo

Willemina Geesien Salomons

Keith S Shih

Birendra K Patnaik

Arthur L Anttila

Mark J Rosner

Shufu Peng

The presently disclosed and/or claimed inventive process(es), procedure(s), method(s), product(s), result(s), and/or concept(s) (collectively hereinafter referred to as the 'presently disclosed and/or claimed inventive concept(s)') relates generally to the composition of a binder for use in battery electrodes and methods of preparing such. More particularly, but not by way of limitation, the presently disclosed and/or claimed inventive concept(s) relates to a binder composition containing an ionizable water soluble polymer and a redispersible powder containing a latex, a protective colloid, and an anticaking agent for use in the production and manufacture of electrodes of a lithium ion battery. Additionally, the presently disclosed and/or claimed inventive concept(s) relates generally to the compositions and methods of making electrodes, both anodes and cathodes, with a binder composition containing an ionizable water soluble polymer and a redispersible powder.

Binder composition for an electrode and methods for producing the same

The presently disclosed and/or claimed inventive concept(s) relates generally to a composition of a slurry for use in preparation of a lithium ion battery. The slurry comprises a binder composition comprising a modified guaran for use in battery electrodes and methods of preparing such. The presently disclosed and/or claimed inventive concept(s) also relates to compositions and methods of making electrodes, either anodes and/or cathodes, with the binder composition comprising the modified guaran.

Modified guaran binder for lithium ion batteries and methods for producing the same

A stabilizer composition comprising an AB type polymer for use in increasing Open Time of aqueous coating compositions is disclosed. The stabilizers compositions are of utility in many aqueous compositions including paints, stains, varnishes, adhesives and inks. Of particular interest is the use of the stabilizer compositions for in increasing the Open Time of latex paints as well as alkyd emulsion paints.

Stabilizers for improved open time of aqueous coatings

The present invention involves a cross-linked carboxylic acid hydrophobically modified copolymer product in which cross-linked carboxylic acid is modified with a non-hydrocarbyl hydrophobe, namely, poly(dimethyl siloxane) or fluoronated alkyl methacrylates.

Non-hydrocarbyl hydrophobically modified polycarboxylic polymers

A mortar cement composition is composed of a cement or ground portland cement clinker, ground limestone and/or lime, sand, a sufficient amount of water to render the composition flowable, and at least one water-soluble polymer present in the amount having a lower limit of about 0.001 wt % and an upper limit of about 0.04 wt % based on total dry weight of the ingredients, with the proviso that the extent of adsorption of the polymer onto the cement is less than 50%, and wherein the resulting mortar has 8-16% air content and greater than 70 psi flexural bond strength. This mortar cement composition is for use in building structures in all seismic zones.

Flexural bond strength/low air/workability additive for mortar cement

A tackifier resin is prepared by polymerizing a monomer mixture of 10-70% piperylene concentrate and 30-90% of a vinyl aromatic monomer in the presence of a boron trifluoride catalyst and an inert diluent. The resin is water white in color, has a Gardner number of less than one, a softening point of 60.degree. to 120.degree. C. and a polydispersity of 1 to 5. The tackifier is used in formulations based on EVA, block copolymers and polyolefins for hot melt and pressure sensitive adhesive applications.

Light colored, aromatic-modified piperylene resins

Described are novel thermosetting maleimide compositions suitable for making cured resins, prepregs and tough thermoset composites. The thermosetting compositions comprise a multifunctional maleimide and a terminally unsaturated polyamide, polyimide, or polyamideimide oligomer which is soluble in the composition. The cured resins have a fracture toughness, K.sub.IC, of at least 1.0 MPam 1/2 and a glass transition temperature of at least 200.degree. C.

Bismaleimide compositions containing high glass transition temperature

Described are novel thermosetting maleimide compositions suitable for making cured resins, prepregs and tough thermoset composites. The thermosetting compositions comprise a multifunctional maleimide and a terminally unsaturated polyamide, polyimide, or polyamideimide oligomer which is soluble in the composition. The cured resins have a fracture toughness, K.sub.IC, of at least 1.0 MPan.sup.1/2 and a glass transition temperature of at least 200.degree. C.

A novel polyfunctional maleimide-based thermosettable resin composition comprising: (a) at least one polyfunctional maleimide compound selected from the group consisting of bismaleimide and polymaleimide, and (b) at least one ether derivative of an alkenylphenol.

Thermosettable resin compositions

Novel thermoplastic compositions are provided comprising a blend of a polyindane resin and an engineering thermoplastic such as polyphenylene ethers, polysulfones, polycarbonates, polyether ether ketones, polyarylates, polyamides, polyimides and polyphenylene sulfides. Blends of thermoplastic block copolymers with polyindane resins are also provided. These blends provide improved processability with good physical properties including high impact strength and high heat distortion temperature.

Polyindanes as processing aid for engineering thermoplastics

Described are novel thermosetting maleimide compositions suitable for making cured resins, prepregs and tough thermoset composites. The thermosetting compositions comprise a multifunctional maleimide and terminally unsaturated polyamide, polyimide, or polyamideimide oligomer which is soluble in the composition. The cured resins have a fracture toughness, K.sub.ic, of at least 1.0 MPam.sup.1/2 and a glass transition temperature of at least 200.degree. C.

Described are novel thermosetting epoxy resin compositions suitable for making cured resins, prepregs and stiff, tough thermoset composites. The thermosetting compositions comprise a polyepoxide component, an amine hardner and a specified amount of certain aromatic oligomers containing functional groups which are reactive with the polyepoxide and/or hardener under curing conditions for the composition. The cured resins have a multiphase morphology which comprises at least one glassy continuous phase and at least one glassy discontinuous phase and have a fracture toughness, K.sub.IC, of at least 1.0 MPam.sup.1/2.

Thermosetting epoxy resin compositions and thermosets therefrom

Disclosed is a stiff, tough thermoset composite, the composite comprising a crosslinked epoxy resin matrix and high strength filaments. The resin matrix comprises a glassy discontinuous phase dispersed in a glassy continuous phase that continues throughout the resin matrix. Volume fractions of the discontinuous phase are at least about 35% of the total volume of the continuous and discontinuous phases combined in exceptionally tough composites. Also disclosed are novel resin compositions suitable for making these thermosets.

Epoxy thermosets having improved toughness

Described are novel thermosetting epoxy resin compositions suitable for making cured resins, prepregs and stiff, tough thermoset composites. The thermosetting compositions comprise a polyepoxide component, an amine hardener and a specified amount of certain aromatic oligomers containing functional groups which are reactive with the polyepoxide and/or hardener under curing conditions for the composition. The cured resins have a multiphase morphology which comprises at least one glassy continuous phase and at least one glassy discontinuous phase and have a fracture toughness, K.sub.IC, of at least 1.0 MPam.sup.1/2.

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Wilmington, DE, United States of America

Sung G Chu