Samsung Electro-Mechanics Co., Ltd.

Lg Chem, Ltd

Hanwha Solutions Corporation

Sung Eun Park

Hyo Soo Lee

Seung Heon Lee

Ji Young Hwang

Jung Sun You

Han Min Seo

Nam Seok Bae

Cheol Ock Song

Hye Won Lee

Tae Gon Lee

Shin Beom Lee

Kee Do Han

Seon Jeong Jin

Wooyoul Ahan

A substrate having a spacer formed thereon, a method of making the same, and an optical device including the same are disclosed herein. In one embodiment, a substrate includes a base layer, and a black column spacer formed on the base layer, wherein the black column spacer has an optical density in a range of 1.1 to 4, and wherein the black column spacer having a curved portion, wherein a cross section of the curved portion having at least one region having curvature.

Substrate

A ball grid array (BGA) package having a half-etched bonding pad and a cut plating line and a method of fabricating the same. In the BGA package, the plating line is cut to form a predetermined uneven bonding pad using half-etching, thereby increasing the contact area between the bonding pad and a solder ball. The BGA package includes a first external layer having a first circuit pattern and a wire bonding pad pattern wherein a chip is connected to a wire bonding pad using wire bonding. A second external layer includes a second circuit pattern, a cut plating line pattern, and a half-etched uneven solder ball pad pattern. In the second external layer, another chip is mounted on a solder ball pad. An insulating layer having a through hole interposed between the first and second external layers and electrically connects the first and second external layers therethrough.

BGA package having half-etched bonding pad and cut plating line and method of fabricating same

In the BGA package and its manufacturing method, a bonding pad is etched from the exposed surface to a part of the insulation layer-coated region so as to form a solder contact side having a dish configuration, which is planar at a bottom center and slanted at a periphery. With this bent structure of the dish configuration, the bonding pad provides an increased bonding area for the solder, so that the BGA package substrate is enhanced in reliability.

BGA package with concave shaped bonding pads

Growing community of inventors

Daejeon, South Korea

Sung Eun Park