Taiwan Semiconductor Manufacturing Comp. Ltd.

Worldwide Semiconductor Manufacturing Corporation

Sung Chun Hsieh

Chien-Jung Wang

Yih-Yuh Doong

Wen-Yu Ho

Sen-Nan Lee

Tsu-bin Shen

Hui-Lun Chen

A semiconductor memory device comprising a test structure is disclosed. The semiconductor device includes a plurality of memory cells, word lines, bit lines, and test pads; the word lines including a first set and a second set of word lines, connected to a first and second word line test pad, respectively; the bit lines including a first set and a second set of bit lines, connected to a first and second bit line test pad, respectively. The first set of word lines and the first set of bit lines access a first set of memory cells, the first set of word lines and the second set of bit lines access a second set of memory cells, the second set of word lines and the first set of bit lines access a third set of memory cells, and the second set of word lines and the second set of bit lines access a fourth set of memory cells. By applying a predetermined set of test signals to the first and second word line test pads, and the first and second bit line test pads, the disturbance or interference among the first, second, third, and fourth set of memory cells can be measured.

Semiconductor device comprising a test structure

A method of reducing tungsten plug loss in processes for fabrication for silicon-based semiconductor devices that include a tungsten plug in a high aspect ratio contact hole. The invention provides a barrier layer prepared by first forming a conformal layer of titanium nitride by chemical vapor deposition. Afterward, another film of titanium nitride is supplied by plasma vapor deposition. The barrier layer comprises at least these two films, and tungsten is then deposited to at least fill the high aspect ratio film-coated contact hole. Upon removal of excess tungsten as by wet etch back, the tungsten plug remains essentially intact, and any plug loss is insignificant in comparison with the prior art.

Method of forming barrier layer for tungsten plugs in interlayer

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Taipei, Taiwan

Sung Chun Hsieh