Growing community of inventors

Mentor, OH, United States of America

Sunder R Rajan

Average Co-Inventor Count = 7.00

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 12

Sunder R Rajan ↔ Dana M Boyd (14 patents)Sunder R Rajan ↔ Christopher J Blackwell (1 patent)Sunder R Rajan ↔ Bernard S Mientus (7 patents)Sunder R Rajan ↔ Farid F Ghiam (1 patent)Sunder R Rajan ↔ Moris Amon (1 patent)Sunder R Rajan ↔ Patricia Ann Harman (1 patent)Sunder R Rajan ↔ Payal Kaul (1 patent)Sunder R Rajan ↔ Richard K Williams, Jr (1 patent)Sunder R Rajan ↔ Jr Richard K Williams (0 patent)Sunder R RajanSunder R Rajan (1 patent)Dana M BoydDana M Boyd (14 patents)Christopher J BlackwellChristopher J Blackwell (10 patents)Bernard S MientusBernard S Mientus (7 patents)Farid F GhiamFarid F Ghiam (6 patents)Moris AmonMoris Amon (3 patents)Patricia Ann HarmanPatricia Ann Harman (1 patent)Payal KaulPayal Kaul (1 patent)Richard K Williams, JrRichard K Williams, Jr (1 patent)Jr Richard K WilliamsJr Richard K Williams (0 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Avery Dennison Corporation (1 from 1,453 patents)


1 patent:

1. 7700189 - Heat shrinkable film with (meth)acrylate resin curable adhesive

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as of
1/8/2026
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