Western Digital Technologies, Inc.

Sundarraj Chandran

Chin-Tien Chiu

Yazhou Zhang

Jiandi Du

Binbin Zheng

Wenbin Qu

A thermoelectric semiconductor device includes a heat dissipating semiconductor module and a stack of flash memory dies mounted on a substrate. The heat dissipating module comprises a first semiconductor die such as a controller, and a second semiconductor die such as a thermoelectric semiconductor die to cool the first semiconductor die during operation. The thermoelectric semiconductor die may be mounted to the controller die at the wafer level.

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Tirunelveli, India

Sundarraj Chandran