Applied Materials, Inc.

Sundarapandian Ramalinga Vijayalaks Reddy

Kirankumar Neelasandra Savandaiah

Adolph Miller Allen

William R Johanson

Zhong Qiang Hua

Viachslav Babayan

Jingjing Liu

Vanessa Faune

Vaibhav Soni

Carl R Johnson

Apparatus and methods for reducing and eliminating accumulation of excessive charged particles from substrate processing systems are provided herein. In some embodiments a process kit for a substrate process chamber includes: a cover ring having a body and a lip extending radially inward from the body, wherein the body has a bottom, a first wall, and a second wall, and wherein a first channel is formed between the second wall and the lip; a grounded shield having a lower inwardly extending ledge that terminates in an upwardly extending portion configured to interface with the first channel of the cover ring; and a bias power receiver coupled to the body and extending through an opening in the grounded shield.

Biased cover ring for a substrate processing system

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Bengaluru, India

Sundarapandian Ramalinga Vijayalaks Reddy