Agilent Technologies, Inc.

Avago Technologies General IP Pte, Ltd.

Sundar A L N Yoganandan

Kee Yean Ng

Thye Linn Mok

Siew It Pang

Tong Fatt Chew

Ju Chin Poh

Fook Chin Ng

A discontinuity-containing, light-diffusing substrate is placed within an LED light source. In one embodiment, the substrate is placed between an LED light source and a light guide. The light diffusing substrate may include a plurality of air bubbles, grooves or both, effective to mix the colored light and yield a white light exiting the light guide. Methods of constructing optical devices and light sources having a bubble-containing substrate are also disclosed.

System and method for light source with discontinuity-containing diffusant

A light emitting device assembly comprises a light emitting diode (LED) chip, a substrate with two terminals, at least one encapsulation layer, and a thermally conductive adhesive to connect the LED chip and the substrate. The first terminal of the substrate is comprised of a portion with a width at least as wide as the LED chip and a vertical cross-sectional area of at least 30% of the total vertical cross-sectional area of the encapsulated assembly, and a straight element. The enlarged first terminal portion provides more area for heat dissipation and conduction, and along with the thermally conductive adhesive and the encapsulation package, provide enhanced thermal conductivity.

System and method for enhanced LED thermal conductivity

Growing community of inventors

Penang, Malaysia

Sundar A L N Yoganandan