Mitsui Chemicals, Inc.

Shiro Kobayashi

Sunao Maeda

Tatsuhiro Urakami

Tadashi Kitamura

Hiroshi Kondo

Tadahito Nobori

Ichisaburo Nakamura

Takeharu Isaki

Tomoyuki Kawabata

Yuichi Itou

Hiroaki Narisawa

Hiroshi Uyama

Yukio Fukui

Gen Miyata

Masako Yoshida

Akihiko Takahashi

Yuzo Ono

Masanobu Maeda

Takaharu Abe

Kazuaki Kikuchi

Yoshitomo Saitou

Masaaki Ozawa

Shinichirou Tawaki

Koutarou Suzuki

Disclosed are a method for producing a laminate including a step of laminating a resin impregnated fiber reinforced composition layer on a metal member, wherein the method includes

Laminate and method for producing same

An object of the present invention is to provide a definitely novel water-based amino resin which is a condensation product of an amino compound (a) having no acid functional group, an amino compound having an acid functional group or an amide compound (b) having an acid functional group, formaldehyde (c) and an alcohol (d), wherein an acid functional group originating in the compound (b) is neutralized with a basic compound (e).

Water-based amino resin and water-based thermosetting resin composition containing the same

A modified phenolic resin that is an alternate copolymer of at least one phenolic compound selected from phenol, naphthols, and their derivatives and a compound having a divalent connecting group, said modified phenolic resin having a side chain attached to an aromatic ring having a hydroxy group, said side chain being represented by defined formula (1-1). The modified phenolic resin can be used as a hardener for epoxy resins and a cured product thereof has excellent adhesion and flame retardancy without impairing properties of conventional phenolic resins such as gel time, glass transition temperature, moisture absorption, and mechanical properties. The epoxy resin composition can provide excellent adhesion and flame retardancy as hardeners for semiconductor sealing epoxy resins, insulating materials for electrical/electronic components, and laminates (printed circuit boards). A prepreg containing a glass substrate impregnated with the epoxy resin composition, a laminate, and an electronic circuit board are also provided.

Modified phenolic resin, epoxy resin composition containing the same, and prepreg containing the composition

A sealant composition for a plastic liquid display cell is composed of a one-component epoxy resin composition of a base resin liquid and a curing agent liquid, wherein the base resin is a liquid epoxy resin having from 1.7 to 6 in weight average of epoxy groups in one molecule and an ionic conductivity of 2 mS/m or less; and the curing agent has an ionic conductivity of 0.6 mS/m or less. The sealant composition facilitates the fabrication of plastic liquid crystal displays having enhanced durability and sealant properties, particularly in high temperature and high humidity environments.

Sealant material for plastic liquid crystal display cells including one component epoxy resin composition

A sealant composition for a plastic liquid crystal display cell is composed of a two-component epoxy resin composition of a base resin liquid and a curing agent liquid, wherein the base resin is a liquid epoxy resin having from 1.7 to 6 in weight average of epoxy groups in one molecule and an ionic conductivity of 2 mS/m or less; and the curing agent has an ionic conductivity of 0.6 mS/m or less. The sealant composition facilitates the fabrication of plastic liquid crystal displays having enhanced durability and sealant properties, particularly in high temperature and high humidity environments.

Sealing material for plastic liquid crystal display cells including two-component epoxy resin composition

An epoxy resin composition comprising an epoxy resin (A), a curing agent (B) and a curing accelerator (C), wherein the curing agent (B) is a phenol compound having two or more hydroxyl functional groups or a compound obtained by esterification of the phenol compound or a mixture of these compounds, and the curing accelerator (C) is a salt of a phosphazenium compound represented by a formula (I):(wherein Rs each represent a hydrogen atom, a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms or an aryl or aralkyl group having 6 to 10 carbon atoms and may be all the same or different from one another; and Zrepresents a halogen anion, hydroxy anion, alkoxy anion, aryloxy anion or carboxy anion).

Curing agent composition for epoxy resins, epoxy resin composition and use thereof

Phenols are reacted with hydrogen peroxide in a solution comprising an organic solvent compatible with water, water, a peroxidase and a dispersing agent to obtain spherical polyphenol particles.

Preparation of spherical polyphenol particles

A method for the homopolymerization or copolymerization of vinyl chloride, wherein the inner wall of the polymerizer and the like are prevented from being fouled with the resulting polymer by applying a coating fluid containing the oxidative polymerization product of a specific phenolic monomer to the surface of the inner wall of the polymerizer and the like, as well as an anti-fouling agent used for this purpose. The method of this invention can very effectively prevent the polymerizer and the like from being fouled with the resulting polymer without affecting the polymerization rate and various properties of the product. Consequently, the necessity of performing the operation for removal of the deposited polymer after completion of each polymerization cycle is eliminated, thus making it possible to achieve closed polymerization requiring no manhole opening after each polymerization cycle which is becoming increasingly popular in recent years.

Method for preventing the inner wall surfaces of the polymerization

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Sodegaura, Japan

Sunao Maeda