Murata Manufacturing Co., Ltd.

The Furukawa Electric Co., Ltd.

Sunao Fukutake

Yoshimasa Nishi

Takeo Uno

Takahiro Tsuruta

Yuko Okuno

Kanto Iida

Yusuke Kamitsubo

Kazuhiko Ohashi

Takeshi Eda

Ryutatsu Mizukami

Akira Moriya

Takayuki Shimamura

A multilayer substrate includes a resin multilayer body including, in a lamination direction, first and second laminate portions respectively including first and second thermoplastic resin layers, and a first interlayer connection conductor extending through the first thermoplastic resin layer. A storage elastic modulus of the first thermoplastic resin layer is lower than that of the second thermoplastic resin layer at a measurement temperature equal to or higher than a minimum melting point among melting points of metallic elements included in the first interlayer connection conductors and equal to or lower than melting points of the first thermoplastic resin layer and the second thermoplastic resin layer.

Multilayer substrate

Provided is a surface-treated copper foil excellent in laser processability. The surface-treated copper foil includes a roughened surface formed by subjecting a surface to a roughening treatment, in which when measured using a three-dimensional roughness meter, the roughened surface has a surface skewness Ssk within a range of from &#x2212;0.300 to less than 0 and an arithmetic mean summit curvature Ssc within a range of from 0.0220 nmto less than 0.0300 nm.

Surface-treated copper foil, and copper-clad laminate and circuit board using same

A black liquid-crystal polymer film that contains a black pigment and a liquid crystal polymer and the black liquid-crystal polymer film has a lightness of 45 or less, a dielectric loss tangent of 0.0035 or less, a minimum dielectric breakdown strength of 60 kV/mm or more, and a maximum-to-minimum ratio of in-plane thermal linear expansion coefficient in the range of 1.0 to 2.5.

Black liquid-crystal polymer film and multilayer board

A metal-clad laminate that includes a metal foil with low surface roughness and in which the adhesion strength between a liquid crystal polymer film and the metal foil is high, the low transmission loss in a high frequency region is low, and the problems associated with warpage and adhesive leakage are alleviated. The metal-clad laminate includes the liquid crystal polymer film, an adhesive layer, and the metal foil, with the adhesive layer and the metal foil stacked on one surface of the liquid crystal polymer film.

Metal-clad laminate, circuit board, and multilayer circuit board

A surface-treated copper foil of the present disclosure includes a copper foil substrate, at least one surface of which has a surface treatment coat including at least a roughening-treated surface on which roughening particles are formed. Observation of a cross-section of the surface-treated copper foil with a scanning electron microscope shows that on a surface of the surface treatment coat, a standard deviation of the particle height of the roughening particles is 0.16 &#x3bc;m or more and 0.30 &#x3bc;m or less, and an average value of the ratio of the particle height to the particle width (particle height/particle width) of the roughening particles is 2.30 or more and 4.00 or less.

Growing community of inventors

Nagaokakyo, Japan

Sunao Fukutake