Japan Gore-tex Inc.

W. L. Gore & Associates, Inc.

Sunao Fukutake

Kazuhiko Ohashi

Akira Urakami

Hiroyoshi Fujimoto

Takayuki Wani

Minoru Hatakeyama

Rie Egashira

Yoshito Hazaki

Kouichi Okino

A liquid crystal-containing precursor for a liquid crystal display device consisting of a porous polytetrafluoroethylene film which has the structure defining the pores treated with a hydrophilic substance. The pores of the treated porous film are substantially filled with liquid crystals. The hydrophilizing treatment increases the transition speed of the liquid crystals from light-scattering orientation to light-transmitting orientation. The liquid crystal-filled film can be covered with transparent non-porous layers of material, having an electrically-conductive film on at least one surface, which can be hermetically sealed at the edges, to permit long-term storage of the liquid crystals in ready-to-use sheet form and easy inclusion into a liquid crystal display device.

LCD article from liquid crystal filled, hydrophilically-coated, porous

A printed circuit board assembly having a coverlay film which is a composite film consisting of a porous fluoropolymer film coated with a thermoplastic or heat-curing adhesive is disclosed. The coverlay film has excellent conformability and adhesion to the printed circuit board and low dielectric constant.

Printed circuit board with a coverlay film

A resin-sealed semiconductor device, including a chip mounting die pad, porous fluorocarbon material located just beneath the die pad, beneath a die-pad supporting layer, gold lead wires, or in a sealing resin surrounding the other components, wherein any water vapor generated by the heat of soldering will be held within the porous fluorocarbon rather than crack the sealant under internal pressure.

Resin-sealed semiconductor device containing porous fluorocarbon resin

A composite material comprising a porous polymeric material bonded to a silicone resin substrate with a silicone-based adhesive agent, wherein only part of the pores of said porous material in the thickness direction thereof contain said silicone-based adhesive agent.

Composite layered material containing a silicone resin substrate

A carrier sheet for printed circuits and semiconductor chips having enhanced adhesion of conductive metal layers to a fluororesin surface resulting from rendering the fluororesin surface hydrophilic by a hydrophilic macromolecule before plating the metal onto the surface.

Carrier sheet for printed circuits and semiconductor chips

A ceramic substrate material containing an amorphous fluorine resin.

Growing community of inventors

Okayama, Japan

Sunao Fukutake