Tencent Technology (shenzhen) Company Limited

Chinese Academy of Sciences

Tencent Technology Company Limited

Sunan Ding

Shengyu Zhang

Wenlong Zhang

Yarui Zheng

Sainan Huai

Chuhong Yang

Yongdan Huang

Kanglin Xiong

Jiagui Feng

Biao Wu

Xiao Chen

This disclosure includes a method for fabricating an air bridge, an air bridge structure, and a superconducting quantum chip, and relates to the field of circuit structures. In some examples, a method for fabricating an air bridge includes forming an air bridge brace structure on a substrate, and forming, on the air bridge brace structure and the substrate, an air bridge material layer with one or more openings in the air bridge material layer that reveal the air bridge brace structure. The air bridge material layer with the one or more openings is formed based on a patterned photoresist layer with patterns corresponding to the one or more openings. The method further includes removing, based on the one or more openings in the air bridge material layer, the air bridge brace structure to obtain the air bridge having the one or more openings.

Method for fabricating air bridge, air bridge structure, and superconducting quantum chip

Growing community of inventors

Guangdong, China

Sunan Ding