Eo Technics Co., Ltd

Sun Youp Lee

Soo Young Kim

Sung Beom Jung

Seung Kwan Choi

Sang Chul Choi

Provided is an apparatus and method for correcting a marking position, in which, by measuring and correcting a marking position by using a processing film for position correction, marking may be accurately performed on a position on a semiconductor chip during a marking operation, before a marking operation is performed on semiconductor chips provided on a wafer. The apparatus for correcting a marking position of a wafer includes a support configured to support a processing film for position correction, a laser head configured to emit a laser beam to the processing film for position correction to form a pattern, a vision camera configured to obtain pattern position information, a movable table configured to move the support in a horizontal direction, and a controller configured to compare and match the pattern position information and marking position information set in the laser head.

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Anyang-si, South Korea

Sun Youp Lee