Other

Tdk-lambda Corporation

Densel Lambda K.k.

Tdk Innoveta Technologies, Inc.

Sun-Wen Cyrus Cheng

Carl M Wildrick

Jeffrey John Boylan

Paulette D Lemond

The present invention provides a configurable dc-dc power converter module and method of manufacture for such module. The power converter module comprises an isolated subassembly with a capacitor bank, control circuits and an isolated power train that converts an input voltage to an intermediate bus voltage. The power module further comprises multiple non-isolated power trains electrically coupled to the isolated subassembly that are powered by the intermediate bus voltage to produce output voltages. The number of output voltages is determined by the number of populated non-isolated power trains, which may include all of the non-isolated power trains in the power module or a subset thereof. In one embodiment of the invention the non-isolated power trains are located on a carrier PWB that is electrically coupled to the bus PWB.

Configurable distributed power module

The present invention provides a DC-DC power converter that comprises two or more Printed Wiring Boards (PWB) mounted parallel to one another and without encapsulation. Electronic components can be mounted on both sides of each board. The open design and parallel orientation of the PWBs allow airflow over components mounted on the PWBs. The PWBs are preferable made of FR-4 with copper foils, with one thicker board being comprised of more copper layers and the other boards comprised of less copper layers. In the preferred embodiment, the power processing elements are housed in the thicker PWB, while the thinner boards house the control circuitry.

Multiple-board power converter

A dual footprint mounting package for a surface mount power converter modules and its method of manufacture. Castellated regions are formed on the edge of the component package using the appropriate sized drill or milling bit. Edge plating is applied to the castellated surfaces to create edge pads. The edge plating provides electrical continuity between the edge pads and the SMT pads. Solder mask, or other materials, is applied to prevent solder from wicking between each SMT pad and its respective edge pad. Such component may be attached to a larger device PWB using either the edge pads or the SMT pads, or may even be attached using a combination of the two, such as in the event of a pad failure or other defect.

Surface mount power module dual footprint

The present invention provides a heat dissipater for use on a circuit board. The invention includes a circuit board having components on at least one side, a rigid plate having thermal conductive properties, and a spring clip that couples said rigid plate to said circuit board and provides a retaining force against the rigid plate. Both the rigid plate and spring clip provide thermal paths to ambient for the circuit board, and in one embodiment, a heat sink or cold plate may be coupled to the rigid plate. Thermal interface material may be filled in between the rigid plate, circuit board and spring clip to provide an efficient thermal path to ambient. The rigid plate, spring clip, and thermal interface material may be electrically insulated.

Growing community of inventors

Plano, TX, United States of America

Sun-Wen Cyrus Cheng