Samsung Electronics Co., Ltd.

Skhynix Inc.

Korea Institute of Science and Technology

Ewha University-Industry Collaboration Foundation

Dongbu Hitek Co., Ltd.

Sun Myung Choi

Jung Hun Lee

Jong Jin Park

Soo Young Lee

Geun Young Kim

Jee Hyun Lee

Kee In Lee

Yun Soo Bae

Mi Sun Seo

Hye Rin Bin

Chan-Woo Park

Geun Ho Choi

Do Min Lee

Ji-Hye Lee

Min Su Park

Ji Won Lee

Jin-Won Kim

Dong-Soo Lee

Jong-Jin Park

Youngkyun Jung

Se Hee Han

Jonghyo Lee

Kyong-Joon Chun

Hyun-ho Kim

JunHyung Kim

Sung Hoon Choi

Young Haeng Lee

Man Lyun Ha

Dong-Jun Kum

Yoon-Deock Lee

Jooyeol Lee

Tae-Il Eom

Ung Su Choi

Ju Il Lee

Yong-kyun Sun

Jeong-Bok Yang

Ki-Hyun Park

Soo Yeol Phyo

Chan Hyuk Park

Provided is a method of fabricating capsules. The method includes: forming droplets of a dispersed phase solution including a phase transition material, a carbon nanomaterial, and a first monomer by allowing the dispersed phase solution to pass through nozzle units provided at a porous membrane in a reaction tank including the porous membrane; migrating the droplets into a mobile phase material including a second monomer; and forming polymer shells at interfaces between the droplets and the mobile phase material by polymerization between the first monomer and the second monomer.

Method and apparatus for fabricating capsule

A semiconductor chip includes a first semiconductor device and a second semiconductor device stacked over the first semiconductor device. The second semiconductor device is electrically connected to the first semiconductor device via a plurality of through electrodes. In a test mode, the first semiconductor device is configured to drive a first pattern of logic levels and a second pattern of logic levels through the plurality of through electrodes, configured to compare logic levels of a plurality of test data generated by the first and second patterns from the first and second semiconductor devices to generate a detection signal indicating that the plurality of through electrodes operated normally or abnormally.

Semiconductor chips including through electrodes and methods of testing the through electrodes

Embodiments of the present disclosure provide a method of manufacturing a metal column using 3D printing technology. The method of manufacturing a metal column includes steps of: creasing a 3D-CAD design for printing the metal column; printing the metal column; pretreating the inner surface of a channel inside the metal column at low temperature; and coating the inner surface of the channel with a stationary phase so that the metal column is capable of separating a gas mixture into components.

Method of manufacturing a metal column

An electronic device includes a replica delay circuit configured to generate a delayed error check signal by delaying a first error check signal including error information of first data stored in a first memory region. The electronic device also includes an error sum signal generation circuit configured to generate an error sum signal by summing a second error check signal including error information of second data stored in a second memory region and the delayed error check signal.

Electronic device for performing error correction operation and error check operation

A semiconductor system includes a first semiconductor device and a second semiconductor device. The first semiconductor device outputs an error check enablement signal, an input clock signal, and input data to the second semiconductor device. The first semiconductor device receives an error check signal from the second semiconductor device. The second semiconductor device performs an error check operation for the input data based on the error check enablement signal and the input clock signal to generate the error check signal which is enabled when an error in the input data occurs.

Semiconductor devices and semiconductor systems including the same

A semiconductor device includes an error detection circuit configured to generate fixed data by fixing any one of a first group and a second group included in internal data to a preset level based on a burst chop signal and an internal command address in response to a read command, and generate an error detection signal by detecting an error of the fixed data; and a data output circuit configured to generate latch data by latching the internal data based on a first latch output control signal, and generate output data by serializing the latch data and the error detection signal based on a second latch output control signal.

Semiconductor device for performing an error check operation

A semiconductor device includes a master chip and a first slave chip. The master chip outputs a write signal or read signal and a chip identification (ID) signal and outputs data through a transmitter activated by the write signal or receives data through a receiver activated by the read signal. The first slave chip enters a write operation according to the write signal and activates a first receiver to store the data when the chip ID signal has a first logic level combination. The first slave chip enters a read operation according to the read signal and configured to activate a first transmitter to output the data when the chip ID signal has a first logic level combination. The master chip and the first slave chip are vertically stacked and are electrically connected to each other by a plurality of through electrodes penetrating the first slave chip.

Semiconductor devices

A semiconductor system including a semiconductor device configured to operate in various modes to generate output data having different patterns.

Semiconductor device and semiconductor system

A semiconductor chip includes a first semiconductor device and a second semiconductor device stacked and coupled through a unidirectional through electrode and a plurality of bidirectional through electrodes, wherein a through electrode in which a failure has occurred among the unidirectional through electrode and the plurality of bidirectional through electrodes is replaced based on a plurality of transfer control signals. The plurality of transfer control signals including failure information on the unidirectional through electrode and the plurality of bidirectional through electrodes.

Semiconductor chip for repairing through electrode

A semiconductor device includes a shift register and a control signal generation circuit. The shift register generates shifted pulses, wherein a number of the shifted pulses is controlled according to a mode of a burst length. The control signal generation circuit generates a control signal for setting a burst operation period according to a period during which the shifted pulses are created. The burst operation period is a period during which a burst operation is performed.

Provided is a fabrication method of print head of MCM device formed micro patterned air gap capable of picoliter-scale droplet printing, and more particularly, is characterized in that comprising preparing silicon waferwashed by piranha solution at step A, stacking silicon nitride filmsandup front surface and back surface of prepared silicon wafer at step B, drying after applying photoresistsandto top surface and bottom surface of the silicon nitride filmandat step C, removing partially the photoresists through pre-determined pattern by irradiation of ultraviolet after arranging photomaskformed through pre-determined pattern in any one side of the photoresistsandat step D, forming sample droplet storage space opening by removing silicon nitride filmcontacted to photoresists removed by pre-determined pattern at step E, removing the photoresistsandstacked up the silicon nitride filmandat step F, forming sample droplet storage spaceby etching the silicon wafer at step G, and forming sample droplet openingby irradiating ultrasonic waves at step H.

Fabrication method of print head for multiplex chemotyping microarray

Electronic device display with an animated graphical user interface

Electronic device with animated graphical user interface

Portable electronic device with animated graphical user interface

Growing community of inventors

Seoul, South Korea

Sun Myung Choi