Ds Global

Lg Innotek Co., Ltd.

Sun Kyun Lee

Gu Berm Jung

Dong Su Nam

Seong Bok Yoon

Provided is a recording medium for a nail sticker and a method of manufacturing the same, and more particularly, to a recording medium and a method of manufacturing the same, which show that an ink reception layer is formed on a base of a polyurethane material so that a nail sticker can be printed using a sublimation printer. The recording medium for a nail sticker comprises: a release paper; an adhesion layer formed on the release paper; a base of a polyurethane material attached onto the adhesion layer; an undercoating layer formed on the base; and an ink reception layer formed on the undercoating layer.

Recording medium for nail sticker and method for manufacturing same

Proposed is a dye-sublimation printer, and more particularly to a dye-sublimation printer that can systematically control upward and downward movements of a pick-up roller, upward and downward movements of a platen roller, and driving of a take-up reel gear according to forward and backward movements of a slide plate.

Dye-sublimation printer and rewinding correction method

Proposed are a thermal transfer ribbon and a sticker printing method using the same, which can form not only full-color images formed by a color ink part but also points, such as pearl, fluorescent, luminous, sparkling, glass, and metal glitters. The thermal transfer ribbon includes: a color ink part having a yellow ink part (Y), a magenta ink part (M), and a cyan ink part (C); an overlay part forming an overlay layer to protect a printed surface; and at least one point ink part provided between the color ink part and the overlay part.

Thermal transfer ribbon, and sticker printing method using same

A light emitting device includes a substrate including a plurality of convex portions, and a first semiconductor layer over the substrate. A plurality of first pits is provided in a top surface of the first semiconductor layer, and a plurality of second pits is provided in the top surface of the first semiconductor layer. A first metallic compound is provided in the first pits, and a second metallic compound is provided in the second pits. A second semiconductor layer is provided over the first semiconductor layer, and a light emitting structure is provided over the second semiconductor layer. The light emitting structure includes a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer.

Growing community of inventors

Seoul, South Korea

Sun Kyun Lee