Samsung Electronics Co., Ltd.

Sun-Kyu Hwang

Seong-Chan Han

Jung-Hoon Kim

Dong-Woo Shin

Jae-Hoon Choi

Dong-Chun Lee

Hyun-Jong Oh

Young-Hwan Park

Nam-Yong Oh

Jae-Joon Oh

Joon-Yong Kim

Ki-Yeol Park

Kyoung-Yeon Kim

A semiconductor module, a socket for the same, and a semiconductor module/socket assembly are disclosed. The semiconductor module includes a printed circuit board including a plurality of semiconductor devices, a plurality of insulating layers and a plurality of metal layers, the plurality of insulating layers and the plurality of metal layers are alternately stacked. Exposed portions of the metal layers are exposed to the outside of the semiconductor module at a first and a second ends of the printed circuit board. The first end and the second end are at opposite ends of the printed circuit board.

Semiconductor module, socket for the same, and semiconductor module/socket assembly

A semiconductor packaging device is provided. Semiconductor package groups, a side retainer wall, and a filling layer may be located on a base plate. The side retainer wall may be located around the semiconductor package groups. The filling layer may be located between the side retainer wall and the semiconductor package groups.

Semiconductor packaging device

Growing community of inventors

Asan-si, South Korea

Sun-Kyu Hwang