Korea Advanced Institute of Science and Technology

Sun Kyu Han

Jong Hun Kim

Hyo Hoon Park

Suk Min Seo

Ji Hwan Park

A photonic radiator device forming a photonic phased array antenna includes a light waveguide including a waveguide clad and a waveguide core using a semiconductor material, and a grating periodically formed an upper or lower part of the light waveguide. The photonic radiator device receives an input light wave in a direction of the grating and the light waveguide and radiates an output light wave to a space by using scattering from the grating.

Nanophotonic radiator using grid structure for application to photonic phased-array antenna

Disclosed is a device which constitutes a photonic phased array antenna. The device includes at least one light source, an optical power distributor configured to distribute a light wave generating from the light source, a phase controller configured a phase of the light wave, and a light wave radiator configured to radiate the light wave into a space based on the controlled phase. Optical waveguides are connected between the light source and the optical power distributor, between the optical power distributor and the phase controller and between the phase controller and the light wave radiator, respectively.

Photonic phased array antenna

A chip packaging method using a hydrophobic surface includes forming superhydrophobic surfaces forming hydrophilic surfaces on predetermined positions of the superhydrophobic surfaces formed on the one of a first chip or the first board and the one of a second chip or a second board, respectively, generating liquid metal balls on the hydrophilic surfaces formed on the one of the first chip or the first board and the one of the second chip or the second board, respectively, and packaging the one of the first chip or the first board and the one of the second chip or the second board by combing the liquid metal ball of the one of the first chip or the first board and the liquid metal ball of the one of the second chip or the second board with each other.

Chip packaging method and chip package using hydrophobic surface

A waveguide of a 3D interconnection structure and an optical data bus system of a 3D interconnection structure using the same are provided. The waveguide includes a main waveguide which is formed in a predetermined direction and at least one branch waveguide which connects to the main waveguide to form a predetermined angle, wherein the at least one branch waveguide branches an optical signal, which is propagated in the main waveguide, at a predetermined rate.

Growing community of inventors

Daejeon, South Korea

Sun Kyu Han