Samsung Electro-mechanics Co., Ltd.

Sun-Kyong Kim

Sung Yi

Do-Jae Yoo

Joon-Seok Kang

Jae-Cheon Doh

Jong-Hwan Baek

An electronic component package and a manufacturing method thereof are disclosed. The electronic component package manufacturing method, which includes mounting an electronic component in one surface of a first insulation layer; bonding a heat sink to the one surface of the first insulation layer, corresponding to the electronic component, to cover the electronic component, the heat sink being formed with a cavity; charging the cavity with an adhesive; and forming a circuit pattern in the other surface of the first insulation layer, can prevent a void from being generated in the adhesive, make the handling stable and make the size small by allowing the heat sink formed with the cavity to cover the electronic component before the pattern build-up and supplying the adhesive through one side of the cavity while providing negative pressure through the other side.

Growing community of inventors

Seoul, South Korea

Sun-Kyong Kim