Korea Institute of Science and Technology

Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Lg Innotek Co., Ltd.

Creamo Inc.

Hyundai Motor Company

Osong Medical Innovation Foundation, Korea University Research and Business Foundation

Nhn Corporation

Chong Kun Dang Corporation

Kia Motors Cornoration

Sun Ho Kim

Seok Pil Lee

Deok Ha Woo

Jae Hun Kim

Young Min Jhon

Young Tae Byun

Ji Hoon Kim

Sung Won Jeong

Shang Hoon Seo

Seung Yeop Kook

Taikjin Lee

Ha Young Ahn

Taik Jin Lee

Chulki Kim

Do Jae Yoo

Min Ah Seo

Jong Chang Yi

Joon Kui Ahn

Kwang Soo Kim

Yong Soo Kim

Bum Seok Suh

Jae Hyun Lim

Min Chul Park

Jeong Hun Shin

Chul Ki Kim

Deokha Woo

Hyunduk Kim

Won Kyo Jeong

Yong-Joon Park

Hyunsoo Chung

Ju Yeong Oh

Chi Woong Jang

Myung Suk Chun

Hyeon Seok Lee

Seung Soo Ha

Sang Hyun Lee

Yong Hee Lee

Jung Woo Kim

Joon Ho Lee

Dong Hwan Kim

Seok Hwan Kim

Hwa Young Kim

Hyun Jun Kim

Beom Ju Shin

Sang Hoon Park

In Soo Park

Kyung Seob Oh

Eun Jung Jo

Seok Heo

Jong In Ryu

Chul Ho Jang

Kyu Hwan Oh

Young Chai Ko

Seong Chan Jun

Kyoung Moo Harr

Se Hyoung Ahn

Christian Romero

Jae O Kwak

Kyeong Bok Min

Chang Mu An

Jae Young Choi

Bong Hyun Kim

Byoung Chul Kim

Hyoung Sik Chun

Sang Hyuck Kim

Young Geun Park

Ki Ho Park

Kwang Moo Lee

Seung Kyun Hong

Woon Jo Cho

Kwang Nam Kang

Yong Hun Jang

Hung Bae Chang

Jong Gwan Kim

Chaemook Lim

JaeChul Hwang

Hyun Seok Song

Sang June Moon

Hui Jin Choe

Kyeong Heon Kim

Yeong Jun Kim

Kyungsun Moon

Youngchul Chung

Jun Hyong Cho

Jong Bom Seo

Min-Chul Park

Young Mo Jung

Eun Gyeong Kim

Hyuk Jae Lee

Byung Kwon Kang

Jin Wook Jeoung

Kyoung Sik Moon

Yoon Ho Park

Dong Sik Jeong

Kyung Chin Yi

Seung Uk Park

Won Young Kang

Woo-Hyung Kim

Jun Young Seo

Jae Seong Kim

Provided is a lithography apparatus including a wafer stage, a cable connected to the wafer stage, the cable being configured to bend based on the wafer stage moving, a support unit configured to prevent the cable from sagging, the support unit including a plurality of clamps configured to restrict movement of the cable and a connection member connecting the plurality of clamps to each other, and a protective unit under the cable, the protective unit being configured to collide with the support unit based on the wafer stage moving, wherein the protective unit includes ultra-high molecular weight polyethylene (UHMWPE).

Lithography apparatus

Disclosed herein are a time synchronization method and apparatus for a low-orbit satellite cluster. The time synchronization method for a low-orbit satellite cluster includes: receiving time information from N participating satellites directly connected; calculating a reference time using time information based on a reliability of each of the N participating satellites; performing time synchronization using the reference time and then recording a synchronization history; and generating a new block using the synchronization history.

Time synchronization method and apparatus for low-orbit satellite cluster

A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer, and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. At least a portion of a first wall of a first trench of the first insulating layer and at least a portion of a second wall of a second trench of the second insulating layer overlap each other vertically. At least a portion of the second wall of the second trench and at least a portion of a third wall of a third trench of the third insulating layer overlap each other vertically.

Fan-out semiconductor package and electronic device including the same

A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.

A vehicle body combination structure includes a center floor panel extending from a lower portion of a vehicle body along a longitudinal direction of the vehicle body, and a rear floor panel disposed at a rear of the vehicle body and connected to the center floor panel, wherein one end surface of the center floor panel and one end surface of the rear floor panel are vertically overlapped to form an overlap region, and wherein the rear floor panel and the center floor panel form a wheel base of the vehicle body.

Rear vehicle body combination structure

An embodiment provides a lighting device comprising: a body having a first opening at a central part thereof; a light source member, which is disposed on the body and includes a circuit board having a plurality of light-emitting elements arranged thereon; and a cover disposed on the light source member and coupled to the body, wherein the circuit board comprises at least one second opening vertically overlapping the first opening and at least one first protrusion protruding toward the inside of the second opening from a side surface of the second opening, and at least one of the light-emitting elements is mounted on the first protrusion.

Lighting device and LED circuit board with a center opening with a protrusion

An assembly unit includes side plate having first coupling member on first side, second coupling member on second side, and third coupling member on each of third and fourth sides, top plate including fourth coupling member and top stud, and bottom plate including fifth coupling member and bottom stud. The first coupling member is engaged with the second coupling member of neighboring side plate. The fourth coupling member is engaged with the third coupling member. The fifth coupling member is engaged with the third coupling member. The first coupling member includes protrusion. The second coupling member includes groove. The protrusion is fitted into the groove of the neighboring side plate. The third coupling member includes thread. Each of the fourth and fifth coupling members includes thread. The fourth and fifth coupling members are engaged with the third coupling member in a screwed manner using the threads.

Assembly unit for toy assembly block

A fan-out semiconductor package includes a core member having a through-hole. A semiconductor chip is in the through-hole and has an active surface with connection pads and an inactive surface opposing the active surface. An encapsulant encapsulates at least portions of the core member and the semiconductor chip and fills at least a portion of the through-hole. A connection member is on the core member and the active surface of the semiconductor chip and includes a redistribution layer electrically connected to the connection pads. The core member includes a groove portion penetrating from a wall of the through-hole up to an outer side surface of the core member in a lower portion of the core member on which the connection member is disposed.

Fan-out semiconductor package

Disclosed are an apparatus for estimating a pedestrian position based on pedestrian motion recognition, and a method therefor. The method for estimating the pedestrian position based on pedestrian motion recognition includes recognizing a specific motion of a plurality of motions of the pedestrian, performing a unique pedestrian dead-reckoning (PDR) technique corresponding to the recognized specific motion among unique PDR techniques for each of the plurality of motions of the pedestrian, and estimating the pedestrian's position by the performed unique PDR technique.

Apparatus for inferring pedestrian position based on pedestrian movement detection, and method therefor

An electronic component package includes a wiring part including an insulating layer, a conductive pattern formed on the insulating layer, and a conductive via connected to the conductive pattern through the insulating layer, an electronic component disposed on the wiring part, a frame disposed on the wiring part and having a component disposition region defined by an inner wall of the frame surrounding the electronic component, and an encapsulant filling at least a portion of the component disposition region. A portion of the inner wall of the frame forms a protrusion protruding toward the electronic component.

Electronic component package having stress alleviation structure

An assembly unit includes a side plate having a plate shape and including a first coupling member on first side, a second coupling member on second side, and a third coupling member on each of third side and fourth side, a top plate having a plate shape and including a fourth coupling member on each side and a top stud on the top surface, and a bottom plate having a plate shape and including a fifth coupling member on each side and a bottom stud on the bottom surface. The first coupling member includes a protrusion. The second coupling member includes a groove. When the first coupling member of the side plate is engaged with the second coupling member of a neighboring side plate of the same type as the side plate, the protrusion of the side plate is fitted into the groove of the neighboring side plate.

Growing community of inventors

Seoul, South Korea

Sun Ho Kim