Amkor Technology, Inc.

Anam Semiconductor Inc.

Amkor Electronics, Inc.

Anam Industrial Co., Ltd.

Sun Ho Ha

Young Wook Heo

Sung Jin Yang

Il Kwon Shim

Byung Joon Han

Sun Jin Son

Ki Ho Kim

A semiconductor package comprising a die paddle defining multiple corners and opposed first and second surfaces. At least one set of leads extends at least partially about the die paddle in spaced relation thereto. Each of the leads has opposed first and second surfaces. Attached to and extending from one of the corners of the die paddle is at least one tie bar which itself has opposed first and second surfaces and at least one aperture disposed therein and extending between the first and second surfaces thereof. Attached to the first surface of the die paddle is a semiconductor die which is electrically connected to at least one of the leads. A package body at least partially covers the die paddle, the leads, the tie bar and the semiconductor die such that the second surfaces of the leads are exposed in and substantially flush with a common exterior surface of the package body, and a portion of the package body extends through the aperture of the tie bar.

Semiconductor package with chamfered corners and method of manufacturing the same

Provided with a method of manufacturing a ball grid array semiconductor package using a flexible circuit board strip, which is directed to prevent minute conductive traces in the outer part of a circuit pattern formed in the flexible circuit board and thus minimize the short-circuits by forming notches on the flexible circuit board in the vicinity of the lower side ends of a resin encapsulant section by use of a punch, and pressing down the resin encapsulant section with a singulation tool to remove the carrier frame and separate the ball grid array semiconductor packages in the piece.

Method of manufacturing ball grid array semiconductor package

A method for reproducing a PCB strip for semiconductor packages, wherein a poor quality PCB unit included in the PCB strip is replaced with a normal quality one, thereby achieving a reduction in the amount of package materials used and an improvement in the process efficiency. The invention also provides a method for fabricating semiconductor packages using the PCB strip reproduction method. A desired portion of a poor quality PCB unit included in a PCB strip is cut out in such a manner that a cutting opening having a peripheral edge extending along the singulation line of the poor quality PCB unit or along a region defined between the singulation line and anti-bending slots of the poor quality PCB unit. In the cutting opening, a separate good quality PCB unit member having the same shape and size as the cutting opening is then fitted. Thus, it is possible to simply and efficiently replace PCB units determined to be of poor quality with separate good quality PCB unit members, respectively.

Method for reproducing printed circuit boards for semiconductor packages

A printed circuit board (PCB) having an epoxy barrier disposed around its throughout slot in a semiconductor chip mounting region, and a BGA semiconductor package using such a PCB, thereby exhibiting a high moisture discharge characteristic. The epoxy barrier includes a copper layer and a solder resist layer both disposed around the throughout slot and is defined by a groove which is disposed around the throughout slot while spacing apart from the periphery of the throughout slot by a desired distance. Alternatively, the epoxy barrier includes a solder resist layer formed to a desired width around the throughout slot on the uppermost layer laminated on the PCB. By virtue of the epoxy barrier, the throughout slot is not closed by epoxy resin coated over the PCB. As a result, it is possible to externally discharge moisture which expands in the PCB upon carrying out a series of processes for the fabrication of the package at a high temperature or mounting the package on a mother board. Accordingly, it is possible to eliminate interface peeling-off and formation of cracks. This results in an improvement in reliance of final products.

Growing community of inventors

Kyungki-Do, South Korea

Sun Ho Ha