Dow Silicones Corporation

Sun-Hee Kim

Ho-jin Choi

Min-Cheol Jeon

A silicone pressure-sensitive adhesive composition is disclosed. The composition can be cured into a pressure-sensitive adhesive having a good release force against a release liner and a high peel force against several substrates. The silicone pressure-sensitive adhesive composition comprises: (A) a diorganopolysiloxane having on average at least 0.5 alkenyl groups with 2 to 12 carbon atoms per molecule; (B) an organopolysiloxane composed of RSiOand SiOunits, wherein each Rrepresents a monovalent hydrocarbon group with 1 to 12 carbon atoms, having a molar ratio (RSiOunit)/(SiOunit) of 0.6 to 1.7, and having a number average molecular weight (Mn) converted to standard polystyrene of from 1,700 to 3,000; (C) an organohydrogenpolysiloxane having on average at least two silicon-bonded hydrogen atoms per molecule; and (D) a hydrosilylation catalyst.

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Uijeongbu-si, South Korea

Sun-Hee Kim