Samsung Electronics Co., Ltd.

Ehwa Diamond Industrial Co., Ltd.

Sun-gyu Park

Hyo-San Lee

Joo-han Lee

Seh-kwang Lee

Yung-jun Kim

Kyu-min Oh

Myung-ki Hong

Sung-oh Park

Chan-ki Yang

A chemical mechanical polishing (CMP) method includes preparing a polishing pad, determining a first load to be applied to a conditioning disk during conditioning of the polishing pad and a first indentation depth at which tips of the conditioning disk are inserted into the polishing pad when the first load is applied to the conditioning disk, preparing a conditioning disk, and positioning the conditioning disk on the polishing pad and conditioning a surface of the polishing pad by using the conditioning disk while applying the first load to the conditioning disk.

Preparing conditioning disk for chemical mechanical polishing and chemical mechanical polishing method including the same

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Seoul, South Korea

Sun-gyu Park