Samsung Electronics Co., Ltd.

Sun Gu Yi

Tae Sang Park

Gyun Heo

Young Jun Moon

Soon Min Hong

Ja Myeong Koo

Disclosed herein is a case structure of an electronic product to which a film-type electronic circuit is adhered. The case structure may include a case of an electronic product and a first film adhered to the case. The case structure may further include a second film adhered to the first film such that one surface of the second film contacts the first film, and an electronic circuit layer adhered to the first film. The electronic circuit layer may be arranged between the first film and the second film, wherein the first film is thermally adhered to the case. The first film may have a melting at a melting point that is lower than a heat-resistant temperature of the case.

Growing community of inventors

Yongin-si, South Korea

Sun Gu Yi