Lg Semicon Co., Ltd.

Institut Francais Du Pe'trole

Hyundai Electronics Industries Co. Ltd.

Hyundai Microelectronics Co., Ltd.

Sun Dong Kim

Alain Billon

Fr&eacute;d&eacute;ric Morel

St&eacute;phane Kressmann

Joon Ki Hong

Sung Ki Ha

Haen Heor

A lead frame includes a pair of guide rails separated at a predetermined space; at least one dam bar for connecting the pair of guide rails; a die paddle for mounting a semiconductor chip between the dam bar; a tie bar for supporting the die paddle; a plurality of leads each consisting of a first lead having a predetermined length extended from the dam bar between the dam bar and the die paddle, a second lead connected electrically to the first lead and formed bent in a first direction, and a third lead connected electrically to the second lead and formed bent in a second direction.

Lead frame and bottom lead semiconductor package using the lead frame

A hydrotreatment process is carried out in at least two steps to hydrotreat a heavy hydrocarbon fraction containing asphaltenes, sulphur-containing impurities and metallic impurities, comprising a first hydrodemetallization step and a subsequent second hydrodesulphurization step, in which the hydrodemetallization step comprises one or more hydrodemetallization zones with fixed beds preceded by at least two hydrodemetallization guard zones (A) and (B), also with fixed beds, disposed in series for cyclic use consisting of successive repetition of steps b) and c) defined below. The process comprises the following steps: a) a step in which the guard zones are used together for a period of at most equal to the deactivation time and/or clogging time of one thereof, b) a step during which the deactivated and/or clogged guard zone is short-circuited and the catalyst it contains is regenerated and/or replaced by fresh catalyst, and c) a step during which the guard zones (A) and (B) are used together, the guard zone where the catalyst has been regenerated during the preceding step being reconnected and said step being carried out for a period at most equal to the deactivation and/or clogging time of one of the guard zones. The process is characterized by introducing a quantity of middle distillate, particularly a gas oil, with the feed representing 0.5% to 80% by weight with respect to the feed. The process can comprise a prior hydrovisbreaking step and optionally a final deasphalting step using a solvent.

Process for hydrotreatment of a heavy hydrocarbon fraction using permutable reactors and introduction of a middle distillate

A component for forming a chip package includes a flat insulative plate. A heat sink is embedded in a central portion of the plate, and a plurality of electrically conductive leads are embedded in peripheral portions of the insulative plate. The leads extend from the top surface of the plate to the bottom surface of the plate, and may also be exposed on side edges of the plate. A recess for receiving a chip may be formed at a central portion of the plate. A chip package utilizing the plate would include a chip mounted on the heat sink, a plurality of wires or solder bumps that connect bond pads on the chip to corresponding leads in the plate, and an insulating material that covers the chip. The insulating material could be a molding resin, or a separate cover plate that covers the chip. In the case of a cover plate, the cover plate may also include an embedded heat sink and embedded leads that can be connected to the embedded leads of the insulative plate.

Semiconductor package substrate and semiconductor package

A lead frame and a semiconductor chip package includes supporters on a lead frame paddle and tiebars using the same for preventing undesired paddle bending which may occur due to the pressure of an epoxy molding compound during the molding process. The supports also allow improved heat dissipation during the molding process of the semiconductor chip package and mounting process of the package onto a printed circuit board.

Lead frame having supporters and semiconductor package using same

A fabrication method for a chip package includes the steps of forming a first substrate having embedded leads, forming a second substrate with embedded leads and a central aperture therethrough, and attaching the second substrate to the first substrate to form a substrate with a recess for receiving a chip. A chip may then be mounted within the central aperture of the second substrate, on the first substrate, and bond pads of the chip may be attached to leads exposed on one of the first and second substrates with a plurality of metal wires. A resin may be molded over the device to protect the metal wires, the chip, and the leads.

Fabrication method for semiconductor package substrate and semiconductor

A lead frame includes a first lead and a second lead formed on the first lead. The second lead may comprise a conductive adhesive and a conductive layer attached to the first lead. Such leads may be used for a package where the second leads are exposed on the outside exterior of a molded resin and/or a semiconductor chip has a plurality of center chip pads.

Lead frame and semiconductor package

An improved plate and column type semiconductor package has a heat sink embedded in a plate, which prevents bending of leads or paddle. The plate includes a plurality of leads and a heat sink which are embedded therein, whereby the mounting of the semiconductor package on the printed circuit board is made easier. A semiconductor chip is attached to the heat sink of the plate and a plurality of metal wires electrically connects a plurality of the leads of the plate and the semiconductor chip.

Growing community of inventors

Choongcheongbuk-Do, South Korea

Sun Dong Kim