Shinko Electric Industries Co., Ltd.

Nichia Corporation

Other

Sumio Uehara

Eiichiro Okahisa

Takuya Hashimoto

Shigeru Matsushita

Katsuya Nakazawa

Kazuhito Yumoto

Suguru Kobayashi

Syuzo Aoki

Kazuto Matsuda

Shuzo Aoki

Shigeo Sato

Yoshihisa Nagamine

Shigeru Togashi

Tsuyoshi Kurosawa

Junichi Nakasato

Takuya Sodeyama

Toshifumi Iizuka

Naoto Kitazume

Mitsuyoshi Nakamura

Mamoru Ittetsu

A method of manufacturing a semiconductor device includes: preparing a bottom plate having an upper surface and a lower surface, wherein the lower surface of the bottom plate comprises a reference part and one or more inclined surfaces that are inclined with respect to the reference part, an upper portion of the one or more inclined surfaces being positioned above the reference part, and wherein a thickness of the bottom plate at the reference part is greater than a thickness of the bottom plate at the upper portion of the one or more inclined surfaces; joining a frame member to the bottom plate, at least a part of the frame member being disposed directly above the one or more inclined surfaces, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the bottom plate.

Semiconductor device, semiconductor device package, and manufacturing methods thereof

A semiconductor device includes: a bottom plate having an upper surface and a lower surface, wherein the upper surface comprises an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part; a frame joined to the upper surface of the bottom plate and comprising a first through-hole that penetrates the frame; a plate jointed to the outside or inside surface of the frame, the plate comprising a second through-hole that penetrates the plate in a same direction as that of the first through-hole, a thickness of the plate being greater than a thickness of the frame; a lead terminal inserted into the first through-hole and the second through-hole; a fixing member provided in the second through-hole and fixing the lead terminal; and a semiconductor element fixed to the inside part.

A method of manufacturing a semiconductor device includes, in this order: preparing a bottom plate having an upper surface and a lower surface, wherein the upper surface includes an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part, and wherein the lower surface of the bottom plate includes a reference part and a recess positioned above the reference part, at least a part of the recess being disposed directly below the outer peripheral part; joining a frame member to the outer peripheral part of the bottom plate, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the inside part of the bottom plate.

A semiconductor modulein which respective upper surfaces of semiconductor elementson both sides of a rectangular circuit boardare covered with radiator platesattached to both sides of the circuit boardso that their outer peripheral edges are not projected from the board surfaces of the circuit board. In this semiconductor module, by projections serving as a pair of attachmentsformed in the vicinity of the center area in a longitudinal direction of the circuit board, the radiator platesare located at predetermined positions. The projections abuts on the corresponding board surface of the circuit boardso that a part of the load applied to the vicinity of the center area of each the radiator platescan be supported by the circuit board

Semiconductor module and radiator plate

In a semiconductor modulein which a semiconductor deviceis mounted on both surfaces of a circuit boardand heat radiation platesare provided to both surfaces of the circuit board to cover the semiconductor device, a fitting hole via which the heat radiation platesare fitted is formed in the circuit board, and a housing recess portionin which the semiconductor devicesare housed is provided to both heat radiation platesfitted to both surfaces of the circuit boardrespectively and a fitting edge portionis provided in a position of both heat radiation plates that overlaps with a position in which the fitting hole is formed, and also a fixing meansfor fixing both heat radiation platesto the circuit boardby caulking to align with the fitting hole is provided to fitting edge portionsintegrally with the heat radiation plates

Semiconductor module and semiconductor module heat radiation plate

There are provided a step of forming a structure in which a first concave portion is formed in a predetermined portion on one surface of a metal plate and also a convex portion that protrudes from other surface of the metal plate is formed by formation of the first concave portion and a second concave portion is formed in a predetermined portion on an outside of a peripheral portion of the convex portion, by shaping the metal plate by means of stamping using a die, and a step of cutting the convex portion formed on the other surface of the metal plate.

Metal plate and method of shaping the same

There is provided a soft ice cream in which even materials such as a strawberry easily changed in properties and containing an acid component can be used, and the unique flavor of the material other than a soft ice cream mix, such as strawberry jam and chocolate, can sufficiently be enjoyed. In the soft ice cream obtained by charging the cream flow of a cooled and semi-hardened soft ice cream mix discharged from a discharge nozzle into a cup so that the discharge shape is maintained as much as possible, the part formed of the strawberry jam is continuously disposed in the part formed of the soft ice cream mix along the cream flow charged into the cup.

Soft ice cream manufacture method thereof and soft ice cream manufacture apparatus

Growing community of inventors

Nagano, Japan

Sumio Uehara