Sony Corporation

Sumio Hokari

Keiki Fukuda

The present disclosure relates to a solid-state imaging device package that enables capturing of higher-quality images, a method of manufacturing the solid-state imaging device package, and an electronic apparatus. The solid-state imaging device package includes: a solid-state imaging device chip that converts light taken in by a lens into an electrical signal; an interposer substrate that secures the solid-state imaging device chip; a frame having a frame structure that encloses the solid-state imaging device chip and prevents emission of unnecessary light onto the light receiving surface of the solid-state imaging device chip; and a protective glass that protects at least the solid-state imaging device chip from external environments, and transmits light. A raised bank structure is formed on the adhesion surface of the frame in contact with the protective glass, and is formed along the entire circumference of the opening portion of the frame. The present technology can be applied to a solid-state imaging device package that encloses an imaging device chip, for example.

Solid-state imaging device package and manufacturing method, and electronic apparatus

The present disclosure relates to a semiconductor package, a sensor module, and a production method for dissipating heat generated by a chip. In a solid-state image sensing element package, an image sensing element chip is bonded and fixed to a heat dissipation plate with a die bond material, the heat dissipation plate having positioning holes and mounting holes for accurately mounting on a lens barrel unit. A circuit board is bonded to a bottom surface of the heat dissipation plate with circuit board adhesive resin. Bonding pads that are electrodes of the image sensing element chip are electrically connected to lead terminals that are electrodes of the circuit board by conduction wires through conduction wire connection clearance holes formed through the heat dissipation plate. The present disclosure is applicable to a CMOS solid-state image sensing apparatus used for an image sensing apparatus such as a camera, for example.

Growing community of inventors

Kanagawa, Japan

Sumio Hokari