Lg Electronics Inc.

Sumin Jun

Jaepyo Hong

Hyeuk Chang

Injoong Kim

Jaechan Kim

A light source module includes at least one light source emitting light, and a body supporting the light source. The body includes a heat sink absorbing heat from the light source and dissipating the heat to the outside, an insulating layer having electrical insulating properties, the insulating layer being provided on at least one surface of the heat sink, and a conductive layer provided on the insulating layer to enable electric current to flow therein. The conductive layer includes an electrically conductive layer providing a path region in which electric current is applied to the light source, and a heat dissipation conductive layer diffusing generated by the light source. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, and promotion of heat dissipation. Furthermore, it is possible to obtain various effects that can be understood through configurations described in embodiments.

Light source module, fabrication method therefor, and lighting device including the same

A light source module includes at least one light source emitting light, and a body supporting the light source, wherein the body includes a heat sink absorbing heat from the light source and dissipating the heat to the outside, an insulating layer having electrical insulating properties, the insulating layer being provided on at least one surface of the heat sink, and a conductive layer contacted with the insulating layer, the conductive layer being at least provided in a path region in which electric current is applied to the light source, the conductive layer being contacted with the light source. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, and promotion of heat dissipation. Furthermore, it is possible to obtain various effects that can be understood through configurations described in embodiments.

A light source module includes at least one light source, and a body supporting the light source. The body includes a heat sink supporting the light source on a top surface thereof, the heat sink absorbing heat from the light source and dissipating the heat to the outside, an insulating layer provided on at least one surface of the heat sink, the insulating layer having electrical insulating properties, and a conductive layer provided on the insulating layer. The conductive layer includes connection regions through which electric current is supplied to the light source, and a light source region disposed between the connection regions, the light source region having the light source mounted therein. A protective layer is stacked in the connection region. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, protection of a conductive material, improvement of the lifespan of products, and enhancement of the stability of products.

A light source module includes at least one light source and a body supporting the light source. The body includes a heat sink supporting the light source on a top surface thereof for absorbing heat from the light source and dissipating the heat to the outside, an electrically insulating layer provided on at least one surface of the heat sink, and a conductive layer provided on the insulating layer, the conductive layer being at least provided in a path region through which electric current is applied to the light source. The conductive layer includes light source connection parts supplying the electric current to the light source, and a light source mounting part disposed between the light source connection parts. One portion of the light source connection part is divided into at least two portions to be connected to each other. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, and optimization of a conductive material.

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Seoul, South Korea

Sumin Jun