Hitachi Chemical Company, Ltd.

Sumiko Nakajima

Akio Takahashi

Fumio Inoue

Akishi Nakaso

Kanji Murakami

Shigeharu Arike

Toshiro Okamura

Kiyoshi Hasegawa

Kiyoshi Yamanoi

Tomoaki Yamashita

Hiroshi Yamamoto

Sadao Itou

An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 &#x3bc;m on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface.

Method for surface treatment of copper and copper

The present invention is aimed to provide an electroless gold plating solution which requires less amount of a reducing agent, retains a sufficient deposition rate for a practical use, and has an excellent stability as a plating solution; and a method for carrying out an electroless gold plating. The present invention provides an electroless gold plating solution comprising a gold salt, a phenyl compound based reducing agent and a water-soluble amine and a method for plating using the gold plating solution.

Electroless gold plating solution and method for electroless plating

An electroless copper plating solution comprising cupric ions, a complexing agent, a reducing agent, a pH adjuster, a perfluoropolyether, a cyanide and/or .alpha.,.alpha.'-dipyridyl and/or 1,10-phenanthroline or a derivative thereof is capable of forming a deposited film with high elongation.

Electroless copper plating solution

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Ibaraki, Japan

Sumiko Nakajima